Semiconductor Pressure Sensor Same-Surface Port Mounting
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Solution Overview
Problem
Existing semiconductor pressure sensors face challenges in achieving small size, low cost, and high detection accuracy due to complex structures and interference from reactive forces, particularly when attempting to measure corrosive or conductive fluids, and struggle with accurate pressure measurement due to the placement of atmosphere and pressure inlet ports.
Innovation Solution
A semiconductor pressure sensor design where the pressure inlet port and atmosphere inlet port are disposed on the same surface, allowing for accurate mounting and preventing interference by positioning the atmosphere inlet port away from the mounting surface, utilizing a case with integrated tubular sections and a sensor chip that measures pressure relative to atmospheric pressure, and incorporating features like concave sections to prevent fluid interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the atmosphere inlet port and pressure inlet port are disposed on opposite sides of the sensor chip, then the sensor structure is simplified and size is reduced, but the atmosphere inlet port may be covered during mounting making accurate pressure measurement difficult
Solution Approach 1:
The patent transitions from a planar arrangement where inlet ports are on opposite sides of the sensor chip to a three-dimensional arrangement where both inlet ports are on the same surface of the case but at different heights. The atmosphere inlet port extends higher than the pressure inlet port, creating vertical separation that prevents covering during mounting while maintaining compact horizontal footprint.
2Reliability
If a stainless steel diaphragm and silicon oil are used to transmit pressure, then the sensor can measure corrosive or conductive fluids, but the structure becomes complicated and cost increases
Solution Approach 1:
The patent removes the stainless steel diaphragm and silicon oil pressure transmission system from the sensor structure. Instead, it uses a semiconductor pressure sensor chip that can directly measure the pressure of corrosive or conductive fluids, eliminating the need for intermediate pressure transmission components while maintaining chemical stability.
Solution Approach 2:
The semiconductor pressure sensor chip serves multiple functions: it directly senses the pressure of the measurement target fluid, eliminates the need for separate diaphragm and pressure transmission medium, and provides electrical output signals. This multi-functional integration simplifies the overall structure while maintaining the ability to measure corrosive or conductive fluids.
3Ease of manufacture
If the atmosphere inlet port is disposed on the mounting surface side, then mounting is simplified, but the port may be covered with potting agent preventing atmosphere introduction
Solution Approach 1:
The patent uses vertical dimension to resolve the conflict between mounting ease and atmosphere introduction function. Both inlet ports are on the mounting surface, but the atmosphere inlet port extends higher than the pressure inlet port. This height difference ensures that during mounting and potting, the atmosphere inlet port remains exposed to introduce atmosphere while the pressure inlet port can be properly connected.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables easy mounting, accurate pressure measurement, and prevents fluid interference, enhancing the reliability and precision of pressure detection while simplifying the sensor structure and reducing size and cost.
Implementation Method 1
a piezoresistance-type semiconductor pressure sensor which detects distortion of a diaphragm section as a resistance value change in diffusion resistance using the piezoresistance effect of silicon
Implementation Method 2
a thin film section called a diaphragm section is formed on a silicon substrate by a micro-machining technique using the properties of silicon as an elastic body, and pressure changes are converted into electric signals
Data Source
AI summary
A semiconductor pressure sensor includes: a case; a pressure inlet port through which a measurement target fluid is introduced into the case; an atmosphere inlet port through which atmosphere is introduced; and a sensor chip configured to measure the pressure of the fluid with respect to atmospheric pressure. The pressure inlet port and the atmosphere inlet port are disposed on the same surface side of the case. The pressure inlet port is communicated with the inside of the case.