Semiconductor Pressure Sensor Lid With O-Ring Retention
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Solution Overview
Problem
The existing semiconductor devices face issues with O-rings easily dropping off during attachment, complicating the assembly process and potentially leading to gaps that allow liquid ingress, which can interfere with pressure detection.
Innovation Solution
A semiconductor device design featuring a lid with an extending portion and a slit that supports the O-ring, preventing it from dislodging and allowing pressure detection through a communicating portion that facilitates fluid circulation while maintaining seal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the O-ring inner diameter is made equal to or larger than the cylindrical member outer diameter to facilitate easy fitting, then the ease of operation is improved, but the O-ring stability deteriorates causing it to easily drop off
Solution Approach 1:
The invention transitions from a simple cylindrical O-ring fitting to a multi-dimensional retention system by adding a retaining groove at the bottom of the through-hole and a retaining rib on the O-ring. This creates radial and axial constraints that prevent the O-ring from dropping off while maintaining easy fitting through the through-hole structure.
Solution Approach 2:
The O-ring is nested within the through-hole structure, with the retaining groove providing an inner containment structure. The O-ring's retaining rib engages with the retaining groove, creating a nested configuration where the O-ring is securely held within the resin package structure.
2Ease of manufacture
If the O-ring is made loose-fitting to enable easy attachment, then the ease of manufacture is improved, but the sealing reliability deteriorates potentially allowing liquid ingress
Solution Approach 1:
The retaining groove and retaining rib are designed in advance as integral features of the resin package and O-ring, respectively. This preliminary structuring ensures that once the O-ring is fitted through the through-hole, it is automatically retained and positioned correctly, maintaining sealing reliability without requiring complex assembly operations.
Solution Approach 2:
The O-ring utilizes its inherent flexibility to be compressed through the through-hole and then retained by the groove-rib interaction. The elastic deformation of the O-ring during assembly allows easy attachment, while its recovery maintains consistent contact pressure for reliable sealing.
Data Source
AI summary
A semiconductor device includes a detector mounted on a base substrate and including a pressure detector to detect pressure, a base portion on the base substrate where the detector is buried, a protruding portion protruding upward from the base portion and including an exposure hole which causes the pressure detector to be exposed upward, and a lid supported by an upper surface of the protruding portion to close the exposure hole. An outer circumferential portion of the lid extends outward from the protruding portion in plan view. The lid includes a slit that is open to an outer side surface and causes the exposure hole to communicate with outside sideward of the semiconductor device.