Semiconductor Probe Socket With Guide Grooves And Retractable Pins
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Solution Overview
Problem
Conventional semiconductor device inspection apparatuses face challenges in achieving precise contact between probe pins and inspection contact points due to alignment tolerances and contamination, leading to increased contact resistance and potential damage from external shocks.
Innovation Solution
The inspection apparatus includes a socket assembly with retractable probe pins, a probe pin supporter, and an inspective object carrier with a floor member featuring embossed coupling portions and dust discharging openings to ensure precise alignment and reduce contamination, preventing jamming and external shocks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alignment holes and aligning pins are used to achieve alignment between probe pins and inspection contact points, then alignment precision is improved, but margin increases due to repetitive coupling and separating causing mismatching
Solution Approach 1:
The guide projection and guide groove are designed to establish preliminary alignment between the socket assembly and floor member before the probe pins make contact with the inspection contact points. This preliminary action ensures that subsequent repetitive coupling and separating operations do not cause mismatching, as the guide structures maintain alignment stability throughout the test process.
2Measurement precision
If probe pins are made small and arranged at narrow pitch to match ball terminals, then measurement precision is improved, but alignment tolerance requirement increases
Solution Approach 1:
The guide projection and guide groove act as intermediary structures that facilitate precise alignment between the probe pins and inspection contact points. These guide structures provide a mechanical intermediary system that compensates for the narrow pitch and small size of the probe pins, ensuring accurate alignment without requiring extremely tight manufacturing tolerances on the probe pins themselves.
3Reliability
If socket assembly and floor member are coupled tightly to prevent jamming, then reliability is improved, but contamination risk increases
Solution Approach 1:
The coupling interface is segmented into distinct functional zones: the guide projection and guide groove for alignment and mechanical coupling, and the dust discharging opening for contamination control. This segmentation allows the coupling to be tight where needed for stability while providing dedicated pathways for contaminant removal, preventing jamming without compromising reliability.
4Reliability
If probe pins are fixed in position for stable contact, then contact stability is improved, but vulnerability to external shocks increases
Solution Approach 1:
The probe pins are designed with retractability, allowing them to dynamically adjust their position in response to external shocks or vibrations. During normal operation, the probe pins maintain stable contact with the inspection contact points. When external shocks occur, the probe pins can retract to absorb the impact, preventing damage while maintaining contact stability during the inspection process.
Data Source
AI summary
Disclosed is an inspection apparatus for a semiconductor device, which is to inspect an electric characteristic of an inspective object having a plurality of electric inspective contact points. The inspection apparatus includes a socket assembly which includes a plurality of probe pins retractable in a longitudinal direction, a probe pin supporter supporting the probe pins in parallel with each other, and a socket board including a plurality of fixed contact points a first end portion of the probe pins, and an inspective object carrier which includes an inspective object accommodating portion accommodating the inspective object so that the inspective contact points face toward a second end portion of the probe pins, and a floor member interposed between the inspective object and the probe pin supporter and including probe holes penetrated corresponding to the inspective contact points and passing the second end portion of the probe pin therethrough.