Semiconductor Test Probe Support for Stable Terminal Contact
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Solution Overview
Problem
Existing semiconductor test apparatuses face issues with insufficient electrical conduction and probe pin breakage due to high load on external terminals, particularly when multiple protrusions contact the terminals, leading to instability and reduced lifespan.
Innovation Solution
A semiconductor test apparatus with a socket base, probe guide, and probe pin design where the probe pin's tip portion is integrated with a probe guide, featuring a decreasing outer diameter, which reduces load and supports the probe pin, enhancing conductivity while minimizing breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If multiple protrusions are formed on the tip portion of the probe pin to contact external terminals, then the load on each contact point is reduced, but electrical conduction becomes insufficient
Solution Approach 1:
The tip portion of the probe pin is designed with a specific geometric shape where the outer diameter decreases as it approaches the tip end, creating a localized high-conductivity region. This local quality change ensures that the tip portion maintains excellent electrical conduction properties while still distributing the load through its contact geometry with the external terminal.
2Reliability
If the probe pin contacts the external terminal with high load, then stable electrical connection is achieved, but the probe pin may break
Solution Approach 1:
The probe guide is positioned to surround and support the probe pin before contact with the external terminal occurs. This beforehand cushioning arrangement prevents excessive load from being applied to the probe pin during the testing process, thereby preventing breakage while maintaining stable electrical connection through proper load distribution.
3Strength
If the probe pin is supported by a probe guide, then breakage is suppressed, but the structure becomes more complex
Solution Approach 1:
The probe guide is designed to surround the probe pin in a nested configuration, where the probe pin passes through the probe guide. This nesting arrangement provides structural support and load distribution to prevent probe pin breakage while maintaining a compact and relatively simple overall structure, avoiding the need for separate complex support mechanisms.
Data Source
AI summary
To provide a semiconductor test apparatus capable of improving the conductivity between a probe pin and an external terminal of a semiconductor device while suppressing the breakage of the probe pin. The semiconductor test apparatus comprises a socket base, a probe guide, and the probe pin. The socket base has a first surface and a second surface opposite the first surface in a first direction. A first opening penetrating the socket base along the first direction is provided. The probe guide is movably disposed within the first opening along the first direction. The probe guide has a first end that protrudes from the first surface when moved from the second surface to the first surface along the first direction, and a second end opposite the first end. A second opening penetrating the probe guide along the first direction is provided.