Semiconductor Probe Test Device Current Measurement
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Solution Overview
Problem
Conventional probe tests for semiconductor devices struggle to accurately analyze the electrical coupling between multiple probes and interface pads, as the voltage measurement remains constant regardless of the number of probes coupled or their coupling strength, making it difficult to determine if each probe is correctly coupled and assessing the coupling strength.
Innovation Solution
A test device and method that applies a test voltage to multiple probes coupled to semiconductor device interface pads, measuring the current flowing through the channel to analyze the coupling state and strength between each probe and pad, using a voltage generating unit, current measuring unit, and result analyzing unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If voltage measurement is used to analyze electrical coupling between probes and pads, then the measurement can be performed, but the voltage remains constant regardless of coupling strength making it impossible to distinguish coupling states
Solution Approach 1:
The patent changes the measurement parameter from voltage to current. By measuring the current flowing through each probe instead of voltage, the system can detect variations in coupling strength since current varies with coupling quality while voltage remains constant, thus resolving the information loss problem
Solution Approach 2:
Instead of measuring voltage at the pad (conventional approach), the patent inverts the measurement approach by measuring current at the probe. This inversion allows detection of coupling strength variations that are invisible in voltage measurements
2Productivity
If multiple probes are coupled to one channel in parallel, then the channel capacity is utilized, but individual probe coupling analysis becomes difficult
Solution Approach 1:
The patent segments the measurement by providing individual current measurement capabilities for each probe within a channel. Although multiple probes share one channel, each probe's current can be measured and analyzed separately, enabling individual coupling analysis while maintaining high channel utilization
3Productivity
If conventional voltage measurement is used, then the test can be performed quickly, but coupling strength assessment is impossible
Solution Approach 1:
The patent changes the measurement parameter from voltage to current, which maintains test speed while enabling coupling strength assessment. Current measurement provides both speed and reliability by varying with coupling strength unlike constant voltage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for accurate analysis of the coupling state and strength between multiple probes and pads, improving the accuracy of the probe test by distinguishing between coupled and uncoupled probes and assessing the coupling strength, thereby enhancing the reliability of semiconductor device testing.
Implementation Method 1
a voltage generating unit configured to generate a test voltage applied to the channel
Implementation Method 2
a current measuring unit configured to measure a current that flows on the channel in response to the test voltage
Data Source
AI summary
A test device of a semiconductor device for testing a semiconductor device including a plurality of interface pads includes a plurality of coupling units, each configured to be coupled to a corresponding one of the plurality of interface pads, a channel configured to be coupled to the plurality of coupling units, a voltage generating unit configured to generate a test voltage applied to the channel, and a current measuring unit configured to measure a current that flows on the channel in response to the test voltage.