Semiconductor Probe Test Region for Reliable Device Verification

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Solution Overview

Problem

The electronic industry faces challenges in reliably testing semiconductor devices due to the need for efficient methods to assess their integration level and performance, which is crucial for ensuring high reliability and integration.

Innovation Solution

A semiconductor device design that includes a substrate with a circuit test region and a probe test region, featuring multiple probe test pads and resistance patterns, allows for the measurement of resistance values to verify the integrity of the probe card before testing the circuit test pads, ensuring reliable testing by comparing measured values against tolerance levels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If probe cards are used to test circuit test pads directly, then testing can be performed, but false failures may occur due to probe card issues

Engineering Contradiction:

Improvetesting reliabilityVSAvoidtesting process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent introduces a probe test region with probe test pads and resistance patterns that enables preliminary testing of the probe card before actual circuit testing. This preliminary action allows probe card functionality to be verified in advance, preventing false failures during subsequent circuit testing while maintaining overall process efficiency.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The substrate is divided into distinct functional regions: a circuit test region with circuit test pads connected to test circuits, and a probe test region with probe test pads and resistance patterns. This segmentation allows independent testing of probe cards separate from circuit testing, enabling reliable probe card verification without interfering with actual device testing.

Inventive Principle:

Principle #1Segmentation

2Reliability

If multiple test regions are added to the substrate, then probe card testing reliability is improved, but device complexity increases

Engineering Contradiction:

Improveprobe card testing reliabilityVSAvoidsubstrate structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The probe test region is integrated into the substrate along with the circuit test region, forming a unified test substrate structure. The probe test pads and resistance patterns are combined in a coordinated manner within the same substrate, allowing probe card testing functionality to be added without requiring entirely separate testing equipment or procedures.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Resistance patterns are introduced as intermediary elements between the probe test pads. These resistance patterns serve as known reference values that mediate the testing process, allowing probe card probe pin functionality to be verified through measured resistance values without directly testing the probe pins themselves.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS8941403B2Semiconductor device and method of testing the same

Publication Date: 2015.01.27 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor device includes a unit region including a circuit test region and a probe test region. The circuit test region includes a test circuit and a plurality of circuit test pads operatively coupled to the test circuit. The probe test region includes first and second probe test pads insulated from the circuit test pads, and a first resistance pattern operatively coupled to the first and second probe test pads.