Semiconductor Probe Testing Without Pads
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Solution Overview
Problem
The existing test processes for semiconductor devices with guard ring structures require conductive patterns to have pads for inspection, which compromises their dielectric strength and prevents optimal configuration.
Innovation Solution
A method and apparatus for testing semiconductor devices that measure resistance values between conductive patterns without pads, using probes pressed vertically to detect conductive foreign matter and open circuits, allowing for optimal dielectric strength configuration while ensuring accurate testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If pads are added to conductive patterns for testing, then ease of operation (testing) is improved, but dielectric strength is worsened
Solution Approach 1:
The invention extracts and eliminates the pads from the conductive pattern structure. By removing the pads that were previously necessary for testing, the conductive patterns can maintain their optimal configuration for dielectric strength while testing is still performed by pressing probes directly against the conductive patterns themselves.
2Ease of manufacture
If pads are added to conductive patterns for testing, then ease of manufacture (testing process) is improved, but device complexity is worsened
Solution Approach 1:
The invention extracts and eliminates the pads from the conductive pattern structure. By removing the pads that were previously necessary for testing, the conductive patterns can maintain their optimal configuration for dielectric strength while testing is still performed by pressing probes directly against the conductive patterns themselves.
3Manufacturing precision
If probes are pressed against conductive patterns without pads, then manufacturing precision is improved, but measurement precision may be worsened
Solution Approach 1:
The invention applies local quality by ensuring that specific regions of the conductive patterns have sufficient surface area and appropriate electrical characteristics to accommodate probe contact. This allows direct probing without pads while maintaining both manufacturing precision and measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the semiconductor device's conductive patterns to maintain optimal dielectric strength configurations while being inspected for foreign matter and open circuits without the need for pads, reducing test time and preventing pattern distortion.
Implementation Method 1
measuring the resistance value between the first and second conductive patterns to determine whether conductive foreign matter is present between the first and second conductive patterns
Data Source
AI summary
A method of testing a semiconductor device includes a conductive foreign matter test step of measuring the resistance value between the first and second conductive patterns to determine whether conductive foreign matter is present between the first and second conductive patterns, a first open circuit test step of measuring the resistance value between two points on the first conductive pattern to determine whether there is an open circuit in the first conductive pattern, and a second open circuit test step of measuring the resistance value between two points on the second conductive pattern to determine whether there is an open circuit in the second conductive pattern. The measurement of the resistance value in each of the test steps is accomplished by pressing probes vertically against the first conductive pattern or the second conductive pattern or both.