Semiconductor Process Control via Dynamic Conversion Factors
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Solution Overview
Problem
The manufacturing of semiconductor devices faces challenges in controlling process conditions for newly developed products, as existing methods rely on empirical data and conversion factors, which can lead to errors and inconsistent process distributions, especially when consumable articles degrade over time.
Innovation Solution
A method and system for automatically calculating process conditions by determining a sample process time using conversion factors based on consumable article consumption time and pattern density, allowing for precise calculation of main process times through equations like Tn={Tn−1+En}×CFn/CFn−1, and storing these values in an information storage table for retrieval and application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If empirical data and conversion factors are used to control process conditions for newly developed products, then process control can be implemented, but errors and inconsistent process distributions occur
Solution Approach 1:
The patent implements a feedback mechanism where process conditions are continuously monitored and adjusted based on actual measurements. The system compares expected process outcomes with actual results and automatically adjusts process parameters to maintain consistency, thereby resolving the reliability issue while keeping the empirical data approach
Solution Approach 2:
The patent dynamically adjusts process parameters such as conversion factors based on real-time process conditions and historical data. By changing parameters adaptively rather than using fixed empirical values, the system maintains process consistency for newly developed products while avoiding errors associated with static empirical data
2Manufacturing precision
If manual feedback is used to control process time by continuously checking thicknesses, then process conditions can be adjusted, but the method is highly sensitive to manufacturer's mistakes and may bring poor process distribution
Solution Approach 1:
The patent enables the system to automatically control process conditions without manual intervention. The control system independently monitors process parameters, compares them with target values, and adjusts process settings automatically, eliminating the sensitivity to manufacturer mistakes while maintaining thickness control precision
Solution Approach 2:
The patent replaces manual mechanical measurement and adjustment processes with automated sensing and control systems. Optical sensors, automated thickness gauges, and computer-controlled process adjustment mechanisms substitute for manual feedback, reducing human error while maintaining manufacturing precision
3Extent of automation
If conversion factors are restricted for use in APC method, then systematic process control is achieved, but newly developed products cannot be manufactured due to lack of established process tables
Solution Approach 1:
The patent performs preliminary actions by pre-calculating and storing process parameters and conversion factors in databases before actual production. For newly developed products, the system pre-establishes process tables using simulation data, historical data from similar products, and theoretical models, enabling immediate manufacturing without requiring extensive empirical data collection
Solution Approach 2:
The patent creates a universal process control system that can handle both established and newly developed products using the same methodology. The system uses generalizable conversion factors and process models that can be adapted to different product types, eliminating the need for product-specific empirical tables while maintaining systematic control
Data Source
AI summary
A method of controlling a semiconductor device manufacturing process for a product which is newly applied and a control system for the same process are provided. According to an embodiment on the control method, a sample process time for a product applied to the semiconductor device manufacturing process for the first time is calculated. The semiconductor device manufacturing process is performed based on the calculated sample process time. Then, a main process time is calculated by applying the stored sample process time to a main process time equation. The semiconductor device manufacturing process can be controlled on the basis of the main process time. The sample process time may be stored in an information storage table.