Semiconductor Process Control via Dynamic Stability Feedback
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Solution Overview
Problem
Current process control methods in lithographic manufacturing for semiconductor devices are limited in effectively monitoring and correcting dynamic behavior and stability, leading to inefficiencies and inaccuracies in pattern application and measurement.
Innovation Solution
A method and device for controlling semiconductor manufacturing processes that obtain performance data and determine process corrections based on dynamic behavior and expected stability, incorporating control parameters from lithographic and etch tools to optimize process stability and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional process control methods are used to monitor and correct manufacturing parameters, then basic process monitoring is achieved, but dynamic behavior and stability cannot be effectively monitored and corrected
Solution Approach 1:
The patent implements a feedback mechanism where performance data from the manufacturing process is continuously obtained, analyzed against control characteristics including dynamic behavior and stability, and used to determine process corrections that are applied back to the manufacturing process. This closed-loop feedback system enables effective monitoring and correction of both dynamic behavior and stability parameters.
Solution Approach 2:
The patent performs preliminary analysis of control characteristics related to dynamic behavior and stability before determining process corrections. By evaluating expected stability in advance and considering residual control potential, the system prepares appropriate corrections proactively rather than reactively, improving both measurement precision and process reliability.
2Manufacturing precision
If process corrections are applied based on performance data alone, then performance parameter adjustments are made, but process stability may be compromised
Solution Approach 1:
Before applying process corrections, the system performs preliminary evaluation of expected stability by analyzing control characteristics and dynamic behavior. This preliminary assessment ensures that corrections are designed to maintain or improve stability while achieving the desired performance parameter adjustments, preventing stability compromise.
Solution Approach 2:
The system continuously monitors performance data and feeds this information back into the correction determination process. By comparing actual process behavior against expected stability criteria, the feedback mechanism adjusts corrections dynamically to maintain both manufacturing precision and process stability.
3Device complexity
If dynamic behavior of control parameters is not considered, then simpler control is achieved, but process control accuracy deteriorates
Solution Approach 1:
The patent explicitly incorporates dynamic behavior of control parameters into the process control system. By modeling and analyzing how control parameters change over time and interact with each other, the system achieves accurate process control that accounts for temporal variations and dynamic interactions, justifying the increased complexity through improved manufacturing precision.
Data Source
AI summary
A method for controlling a manufacturing process for manufacturing semiconductor devices, the method including: obtaining performance data indicative of the performance of the manufacturing process, the performance data including values for a performance parameter across a substrate subject to the manufacturing process; and determining a process correction for the manufacturing process based on the performance data and at least one control characteristic related to a dynamic behavior of one or more control parameters of the manufacturing process, wherein the determining is further based on an expected stability of the manufacturing process when applying the process correction.