Semiconductor Process Evaluation via Step Parameter Association

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Solution Overview

Problem

Current semiconductor manufacturing processes face challenges in evaluating and controlling overlay errors and critical dimension uniformity due to non-uniform stress and aggressive process steps, which can lead to misalignment and performance issues in semiconductor devices.

Innovation Solution

A method and apparatus that retrieve and associate process step parameters, including measurement, context, and control data, to evaluate and modify the semiconductor manufacturing process flow, enabling better evaluation and correction of process steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If aggressive semiconductor manufacturing processes are used to increase productivity, then manufacturing output increases, but overlay precision and critical dimension uniformity deteriorate due to non-uniform stress and deformation

Engineering Contradiction:

Improvemanufacturing outputVSAvoidoverlay precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The system performs preliminary actions by collecting and analyzing process data before manufacturing defects occur. Measurement data from process steps is retrieved and associated with process flows in advance, enabling prediction of overlay errors and critical dimension variations before they affect final product quality, thus allowing preventive corrections to be made

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system implements feedback mechanisms by continuously retrieving measurement data from process steps, associating it with process flows, and using this information to evaluate and control subsequent manufacturing steps. This closed-loop feedback enables real-time adjustments to maintain overlay precision and critical dimension uniformity even during aggressive manufacturing processes

Inventive Principle:

Principle #23Feedback

2Adaptability or versatility

If multiple process steps are performed to achieve complex device functionality, then device capability increases, but process control complexity and difficulty of detecting and measuring defects increase

Engineering Contradiction:

Improvedevice capabilityVSAvoidprocess control difficulty

Core Design Contradiction:

Adaptability or versatilityVSDifficulty of detecting and measuring

Solution Approach 1:

The system segments the complex manufacturing process into individual process steps, each with associated measurement data. By dividing the overall process flow into discrete, manageable segments and retrieving measurement data for each segment separately, the system makes it easier to track and analyze specific process parameters without being overwhelmed by the complexity of the entire multi-step process

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system introduces an intermediary data association mechanism that links measurement data from various process steps to their corresponding process flows. This intermediary layer organizes and structures the complex data from multiple process steps, making it more manageable and easier to analyze for detecting process control issues

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS10310490B2Method and apparatus of evaluating a semiconductor manufacturing process

Publication Date: 2019.06.04 QONIAC

AI summary

A method and apparatus for evaluating and controlling a semiconductor manufacturing process having a plurality of process steps in a process flow is described. The method comprises retrieving measurements of process step parameters from a process measurement database. The process step parameters comprise at least one of process step measurement data, process step context data or process step control data. The process step parameters are subsequently associated with one or more of the process steps.