Semiconductor Processing Chamber with Segmented Wafer Zones

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Solution Overview

Problem

Conventional semiconductor processing apparatuses face issues with asymmetric processing spaces, inadequate separation of wafer supporting units, increased processing time, and substrate contamination due to exposure to air, leading to reduced reliability and productivity.

Innovation Solution

The apparatus features a reaction chamber with symmetrically formed processing spaces, separated by a movable cylinder valve and an exhausting system, along with a cassette unit for rapid substrate handling and temperature control, minimizing exposure to air and optimizing processing conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple wafer supporting units are disposed in the processing chamber, then productivity is improved, but processing spaces are not separated causing inferior processes such as reaction gas occurrence and gas mixture

Engineering Contradiction:

ImproveproductivityVSAvoidreliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The processing chamber is divided into multiple independent processing spaces by partition walls, with each space containing a separate wafer supporting unit. This segmentation allows multiple wafers to be processed simultaneously while maintaining independent atmospheric conditions in each space, preventing gas mixture and reaction gas occurrence between adjacent processing zones.

Inventive Principle:

Principle #1Segmentation

2Productivity

If wafer supporting units are disposed close to each other, then processing chamber space is utilized efficiently, but uniform processing conditions cannot be formed due to asymmetric processing space

Engineering Contradiction:

Improveprocessing efficiencyVSAvoidprocessing condition uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The partition walls are positioned asymmetrically within the processing chamber to create balanced, symmetric processing spaces around a central axis. This asymmetric placement of dividing structures achieves symmetric atmospheric conditions in each processing space, ensuring uniform gas distribution and plasma formation despite the close proximity of multiple wafer supporting units.

Inventive Principle:

Principle #4Asymmetry

3Duration of action of moving object

If processing time is increased, then thorough processing is achieved, but substrate is exposed to air for long time causing contamination

Engineering Contradiction:

Improveprocessing timeVSAvoidcontamination

Core Design Contradiction:

Duration of action of moving objectVSObject-affected harmful factors

Solution Approach 1:

Multiple wafer supporting units operate simultaneously in parallel, allowing continuous processing of multiple substrates without interruption. While one substrate is being processed, others are being loaded or unloaded, eliminating idle time and reducing the duration each substrate remains exposed to air during transfer operations.

Inventive Principle:

Principle #20Continuity of useful action

4Temperature

If waiting time for cooling processed substrate is increased, then proper cooling is achieved, but entire processing time is increased thus lowering productivity

Engineering Contradiction:

Improvecooling effectivenessVSAvoidprocessing throughput

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The cooling function is merged into the cassette unit structure, which serves dual purposes: storing substrates and providing active cooling. The cassette unit with cooling capability allows processed substrates to be rapidly cooled immediately after processing, eliminating separate cooling wait time and enabling faster throughput while maintaining proper temperature control.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances processing reliability by maintaining a uniform atmosphere, reduces processing time, and minimizes contamination, thereby improving productivity and yield.

Implementation Method 1

one or more shower heads disposed at an upper side of the reaction chamber, for spraying gas so as to perform semiconductor processing

Methodology Applied

Scientific EffectGas spraying: Fluid Spray

Implementation Method 2

an exhausting system connected to the processing space forming unit for controlling a pressure and air exhaustion inside the reaction chamber and the processing space formed by the processing space forming unit

Methodology Applied

Scientific EffectPressure control: Pressure Increase

Data Source

PatentUS8741096B2Apparatus for semiconductor processing

Publication Date: 2014.06.03 WONIK IPS CO LTD

AI summary

An apparatus for semiconductor processing capable of performing semiconductor processing such as etching, depositing, etc. on a surface of a substrate such as a wafer. The apparatus for semiconductor processing, comprises: a reaction chamber having a gate through which a substrate to be processed is transferred; one or more shower heads disposed at an upper side of the reaction chamber, for spraying gas so as to perform semiconductor processing; one or more wafer supporting units disposed at an inner lower side of the reaction chamber in correspondence to each of the shower heads, for supporting the substrate; a processing space forming unit disposed in the reaction chamber, for forming a processing space for semiconductor processing by sealing the shower heads and the wafer supporting units; and an exhausting system connected to the processing space forming unit for controlling a pressure and air exhaustion inside the reaction chamber and the processing space formed by the processing space forming unit.