Condensation suppressing method and processing apparatus
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Solution Overview
Problem
In semiconductor processing apparatuses, condensation occurs due to temperature drops below room temperature, potentially leading to electrical component failure and requiring additional space for thermal insulation or heating, which complicates apparatus scaling.
Innovation Solution
A method involving a processing apparatus with a first temperature measuring unit, a supply line for low-dew point gas, and a control unit that adjusts the flow rate of the gas to maintain optimal humidity levels, preventing condensation while minimizing gas consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal insulator or heating device is used to suppress condensation, then condensation is prevented, but apparatus scale-down becomes difficult due to space requirements
Solution Approach 1:
The invention changes the dew point parameter of the gas environment by introducing low-dew point gas (such as dried nitrogen or dry air) into the closed space. This parameter change prevents condensation by ensuring the dew point of the gas is lower than the lowest temperature of any component surface, eliminating the need for thermal insulators or heating devices and enabling apparatus scale-down.
2Reliability
If heating device is used to prevent condensation, then condensation is suppressed, but cooling performance degrades due to heat transfer to coolant
Solution Approach 1:
The invention creates an inert environment by filling the closed space with low-dew point gas that is impermeable to moisture. This inert gas atmosphere prevents moisture from condensing on cooled components, allowing the coolant to maintain low temperatures without causing condensation, thus preserving cooling performance while preventing condensation.
3Reliability
If low-dew point gas is supplied in large amount, then condensation is suppressed, but gas consumption increases
Solution Approach 1:
The invention implements feedback control by using a temperature measuring unit to monitor the temperature of components in the closed space. The control unit adjusts the flow rate of low-dew point gas based on this temperature information, supplying gas at the minimum necessary rate to maintain dew point below component temperatures, thereby suppressing condensation while minimizing gas consumption.
Solution Approach 2:
The invention makes the gas supply rate dynamic by adjusting it according to real-time temperature conditions. The flow rate is not fixed but varies based on the measured component temperatures and environmental conditions, allowing the system to optimize gas consumption while ensuring condensation suppression under varying operational conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses condensation on apparatus components without the need for additional insulation or heating, reducing the consumption of low-dew point gas and allowing for more compact processing apparatus designs.
Implementation Method 1
condensation may occur at a portion of the placing table which is in contact with exterior air
Implementation Method 2
the semiconductor wafer is cooled through the placing table
Data Source
AI summary
A processing apparatus includes a first temperature measuring unit configured to measure a surface temperature of a first member exposed in a first closed space, a supply line configured to supply a low-dew point gas into the first closed space and a control unit configured to control a flow rate of the low-dew point gas. The control unit performs a first process to a third process. In the first process, an absolute humidity of a gas within the first closed space at a position of a surface of the first member is specified for the flow rate of the low-dew point gas. In the second process, a saturated absolute humidity at the surface temperature of the first member is specified. In the third process, the flow rate of the low-dew point gas is controlled based on the absolute humidity of the gas and the saturated absolute humidity.