Semiconductor processing platform for reduced energy consumption

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Solution Overview

Problem

Existing semiconductor processing tools waste thermal energy without recapturing it, leading to inefficiency and high energy consumption.

Innovation Solution

Integration of heat exchangers and heat pumps in semiconductor processing chambers to recover thermal energy from waste fluids and chemicals, using recirculation loops, thermal storage, and pre-heating tanks to reduce the thermal load on heaters.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal systems are employed to control processing temperature in semiconductor processing chambers, then temperature control is achieved, but thermal energy is exhausted without recapturing it, leading to high energy consumption

Engineering Contradiction:
Improveprocessing temperature controlVSAvoidthermal energy waste
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent implements a heat recovery system that captures thermal energy from exhaust gases and waste fluids leaving the semiconductor processing chambers. Heat exchangers transfer this waste thermal energy to pre-heat incoming process gases and chemicals, thereby recovering what would otherwise be discarded thermal energy and reducing the load on primary heating systems.

Inventive Principle:
Principle #34Discarding and recovering

Solution Approach 2:

The system performs preliminary heating of process gases and chemicals using recovered thermal energy before they enter the processing chambers. This pre-heating action reduces the additional energy required by primary heaters to reach the required processing temperatures, thereby reducing overall energy consumption.

Inventive Principle:
Principle #10Preliminary action

2Stability of the object's composition

If multiple heaters are used to maintain temperature in processing chambers and fluid systems, then temperature stability is achieved, but device complexity and cost increase

Engineering Contradiction:
Improvetemperature stabilityVSAvoidnumber of heaters
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent combines multiple heating functions into a unified heat recovery and redistribution system. By capturing thermal energy from multiple exhaust streams and consolidating it into a centralized heat exchange network, the system maintains temperature stability across multiple processing zones using fewer independent heaters, thereby reducing system complexity.

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If thermal energy is not recaptured from waste fluids, then system simplicity is maintained, but energy efficiency deteriorates

Engineering Contradiction:
Improvesystem simplicityVSAvoidenergy efficiency
Core Design Contradiction:
Device complexityVSUse of energy by moving object

Solution Approach 1:

The patent introduces heat exchangers as intermediary devices that facilitate thermal energy transfer from waste fluids to incoming process materials. These intermediaries enable energy recovery without fundamentally redesigning the entire processing system, thereby improving energy efficiency while adding minimal complexity through standardized heat exchange components.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves energy efficiency, reduces the number of heaters needed, lowers overall tool cost, and promotes sustainability by minimizing power consumption and waste heat recovery.

Implementation Method 1

a heat exchanger including a supply-side flow path in fluid communication with the input portion and a heat delivery-side flow path in fluid communication with the waste system, wherein the heat exchanger is configured to transfer thermal energy from the waste system to the input portion to heat the first fluid prior to heating by the heater

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS20260060030A1Semiconductor processing platform for reduced energy consumption
Publication Date: 2026.02.26 TOKYO ELECTRON LTD
  • US20260060030A1 patent drawing
  • US20260060030A1 patent drawing
  • US20260060030A1 patent drawing

AI summary

A system includes one or more semiconductor processing chambers, and a processing fluid supply system including an input portion configured to receive a first fluid from a first fluid source, a heater fluidly coupled to the input portion and configured to heat the first fluid, and a heated flow portion fluidly coupled to the heater and configured to deliver a heated processing fluid including the first fluid heated by the heater to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or a semiconductor processing chamber. A heat exchanger includes a supply-side flow path in fluid communication with the input portion and a heat delivery-side flow path in fluid communication with the waste system. The heat exchanger is configured to transfer thermal energy from the waste system to the input portion to heat the first fluid.