Tools and systems for processing one or more semiconductor devices, and related methods
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Solution Overview
Problem
Semiconductor wafer processing tools face challenges in maintaining desired temperatures within tight tolerances and time frames, especially when large temperature changes are required, leading to excessive thermal loads on chillers and undesired temperature surges in heating and cooling systems.
Innovation Solution
A heating and cooling apparatus with a hot tank and cold tank, along with a temporary storage tank, is used to manage thermal transfer fluids, allowing for rapid and precise temperature changes of up to 300°C without excessive heating or cooling times by directing surge volumes of thermal transfer fluid to temporary tanks for temperature equilibration before returning them to the main tanks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the temperature of the etch tool is changed by a temperature greater than about 50°C, then the thermal load on the chiller becomes too large, but the temperature control within desired tolerances and time frames cannot be achieved
Solution Approach 1:
The thermal transfer fluid system is segmented into multiple zones: a first thermal transfer fluid in communication with the chiller, a second thermal transfer fluid in communication with the heater, and a third thermal transfer fluid that couples both systems. This segmentation allows independent temperature control of heating and cooling paths, enabling large temperature changes without overwhelming the chiller's thermal load capacity.
Solution Approach 2:
A third thermal transfer fluid acts as an intermediary between the chiller's first thermal transfer fluid and the heater's second thermal transfer fluid. This intermediary fluid facilitates controlled thermal energy transfer, allowing the system to achieve desired temperature changes while distributing thermal load appropriately and maintaining temperature control stability.
2Productivity
If rapid temperature changes are implemented to improve processing efficiency, then temperature deviation in tanks increases, but precise temperature control within tight tolerances deteriorates
Solution Approach 1:
The system dynamically switches between heating and cooling modes using a controller that monitors temperature conditions and activates appropriate thermal pathways. The dynamic configuration of thermal communication paths allows rapid response to temperature requirements while maintaining precision through controlled activation sequences and adaptive thermal management.
Solution Approach 2:
The system changes thermal parameters by switching which thermal transfer fluids are active and how they are coupled. By changing the configuration of thermal communication paths and adjusting fluid flow parameters, the system achieves rapid temperature changes while maintaining precise control through controlled parameter transitions rather than uncontrolled thermal surges.
3Reliability
If the thermal load on the chiller is reduced to maintain temperature stability, then the ability to perform rapid temperature changes for cleaning and processing deteriorates
Solution Approach 1:
The system merges the heating and cooling thermal transfer fluid paths through the third thermal transfer fluid that couples both the chiller and heater systems. This merging allows coordinated operation where the heater can provide rapid temperature increases for cleaning cycles while the chiller maintains stability during processing, achieving both rapid change capability and temperature stability through unified thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables rapid and precise temperature control of semiconductor wafers, reducing temperature deviation in the tanks and improving processing efficiency by minimizing thermal load spikes, allowing for temperature changes within less than a minute.
Implementation Method 1
A heating and cooling apparatus with a hot tank and cold tank, along with a temporary storage tank, is used to manage thermal transfer fluids
Implementation Method 2
directing surge volumes of thermal transfer fluid to temporary tanks for temperature equilibration before returning them to the main tanks
Implementation Method 3
directing surge volumes of thermal transfer fluid to temporary tanks for temperature equilibration before returning them to the main tanks
Data Source
AI summary
A system for fabricating a semiconductor device structure includes a tool comprising a chamber and a platform within the chamber configured to receive a semiconductor device structure thereon. The tool further includes a heating and cooling system in operable communication with the platform and configured to control a temperature of the platform. The heating and cooling system comprises a cooling system including a cold tank for containing a cold thermal transfer fluid, the cold tank configured to be in fluid communication with the platform, thermal transfer fluid supply piping, and thermal transfer fluid return piping, a heating system including a hot tank for containing a hot thermal transfer fluid having a higher temperature than the cold thermal transfer fluid, the hot tank configured to be in fluid communication with the platform, the thermal transfer fluid supply piping, and the thermal transfer fluid return piping, and at least one temporary storage tank configured to receive at least some of the cold thermal transfer fluid or the hot thermal transfer fluid from at least the thermal transfer fluid return piping after switching a thermal load from the platform from one of the cooling system or the heating system to the other of the cooling system or the heating system. Related methods and tools are disclosed.