Semiconductor Package Projections for Force Detection
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Solution Overview
Problem
Existing force sensors face challenges in effectively detecting forces experienced by mechanical members due to damping or absorption of forces during mounting, leading to reduced data quality and inadequate detection of targeted forces or force directions.
Innovation Solution
A semiconductor package with a mold compound covering a semiconductor die and a die pad featuring a pattern of projections that engage with a mounting surface, amplifying specific forces or force directions by securely transferring them to the sensor for accurate detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a force sensor is mounted to a mechanical member using conventional mounting methods, then the sensor can detect forces, but the mounting process dampens or absorbs forces leading to reduced detection accuracy and data quality
Solution Approach 1:
The engagement surface is segmented into multiple discrete projections rather than a continuous flat surface. These projections are distributed across the engagement surface and engage with corresponding recesses in the mounting surface, creating multiple localized force transfer paths that prevent force damping while maintaining detection accuracy
Solution Approach 2:
The engagement surface has non-uniform local properties with projections concentrated in specific regions and varying heights or areas. This local variation optimizes force transfer in specific directions while maintaining overall mounting reliability, allowing the sensor to detect forces in targeted directions with high accuracy
2Ease of manufacture
If the engagement surface is made flat and simple for ease of manufacture, then manufacturing is easier, but force transfer to the sensor is inadequate leading to poor detection of targeted forces
Solution Approach 1:
The engagement surface is divided into multiple projections that can be formed using standard semiconductor manufacturing techniques such as photolithography and etching. This segmented structure achieves complex force transfer functionality while remaining compatible with existing fabrication processes
Solution Approach 2:
The engagement surface utilizes three-dimensional projections with varying heights, areas, or shapes rather than a two-dimensional flat surface. This dimensional enhancement allows the structure to transfer forces in multiple directions and magnitudes while still being manufacturable using layer-based semiconductor processes
Data Source
AI summary
An example semiconductor package includes a semiconductor die configured to detect a force. In addition, the semiconductor package includes a mold compound covering the semiconductor die. Further, the semiconductor package includes an engagement surface including a pattern of projections adapted to engage with a mounting surface on a member of interest.