Semiconductor Protection Circuit for Output Driver Overheat
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for thermally protecting output driver elements in semiconductor devices face challenges in accurately measuring central temperatures due to non-uniformity and heat generation variations, leading to potential destruction from local breakdown and electromigration, especially when abnormalities occur in power supply or load.
Innovation Solution
A protection circuit that includes a measurer to quantify supply power, an estimator to calculate temperature rise, a detector to sense ambient temperature, and a determiner to output a cutoff signal when the estimated temperature exceeds a threshold, using a diode unit for temperature measurement and a comparator to assess the overheat state, thereby ensuring reliable protection of the output driver element and the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is arranged near the output driver element to perform accurate temperature measurement, then temperature measurement accuracy is improved, but device structure complexity increases and arrangement difficulty arises
Solution Approach 1:
The patent uses a diode unit as a simplified copy of a temperature sensor, measuring temperature through voltage characteristics rather than requiring complex sensor structures. This copying approach achieves temperature measurement functionality with simpler device structure.
Solution Approach 2:
The patent introduces a diode unit as an intermediary element between the output driver element and the measurement system. The diode unit converts temperature information into voltage signals that can be measured and processed, avoiding direct complex sensor integration near the driver element.
2Measurement precision
If a temperature sensor is embedded inside an output element to measure central temperature, then temperature measurement accuracy is improved, but device reliability deteriorates due to local breakdown and electromigration
Solution Approach 1:
The patent extracts the temperature measurement function from the output driver element itself by using a separate diode unit. This extraction removes the harmful embedded sensor structure that causes local breakdown and electromigration while preserving the temperature measurement capability.
Solution Approach 2:
Instead of embedding a complex temperature sensor inside the driver element, the patent uses a diode unit as a simplified copy that measures temperature through voltage characteristics, achieving the measurement function without the reliability-damaging embedded structure.
3Device complexity
If temperature estimation method is used to avoid arrangement difficulty, then device structure complexity is reduced, but measurement precision deteriorates due to heat generation variations
Solution Approach 1:
The patent implements a feedback mechanism by continuously monitoring the voltage of the diode unit and comparing it with reference values. This feedback approach allows the system to dynamically adjust and accurately determine temperature despite variations in heat generation, overcoming the limitations of simple estimation methods.
Solution Approach 2:
The patent replaces physical temperature sensors with an electrical measurement system using diode voltage characteristics. This substitution achieves temperature measurement through electrical properties rather than mechanical sensor arrangements, reducing device complexity while maintaining precision through electrical feedback control.
4Measurement precision
If additional diffusion regions, contacts, and interconnection lines are added for temperature sensor, then temperature measurement capability is improved, but device reliability deteriorates due to local breakdown and electromigration
Solution Approach 1:
The patent extracts the temperature measurement function from the complex embedded sensor structure and implements it through a simpler diode unit. This extraction removes the additional diffusion regions, contacts, and interconnection lines that cause reliability issues while preserving temperature measurement capability.
Solution Approach 2:
The patent uses a diode unit as a simplified copy of a temperature sensor that requires minimal additional structure. This copying approach achieves temperature measurement functionality without adding the reliability-damaging diffusion regions, contacts, and interconnection lines associated with conventional embedded sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for accurate detection and prevention of overheating in output driver elements by estimating central temperatures based on supply power, ensuring timely protection and preventing thermal destruction of the semiconductor device.
Implementation Method 1
a detector configured to detect an ambient temperature of the output driver element
Implementation Method 2
a measurer configured to measure, as a measurement value, a value proportional to a supply power amount to the output driver element
Implementation Method 3
an estimator configured to estimate a temperature rise amount of the output driver element corresponding to the supply power amount
Data Source
AI summary
According to one embodiment, a protection circuit is a protection circuit for protecting an output driver element from overheat, and includes a measurer configured to measure, as a measurement value, a value proportional to a supply power amount to the output driver element, an estimator configured to estimate a temperature rise amount of the output driver element corresponding to the supply power amount, on a basis of the measurement value, a detector configured to detect an ambient temperature of the output driver element, and a determiner configured to determine whether a temperature obtained by adding the temperature rise amount estimated to the ambient temperature exceeds a predetermined threshold temperature, and to output a cutoff instruction signal for the output driver element.