Semiconductor Package Protection Layer Thickness Variation
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Solution Overview
Problem
In optical land grid array (OLGA) structures, contaminants can enter vent holes due to a height difference between protection layers, leading to gaps between the protection layer and tape, which can damage chips or dies during the singulation process.
Innovation Solution
A semiconductor package device design where the protection layer has varying thicknesses, with a thicker portion adjacent to the vent hole to ensure hermetic attachment to the tape, and optionally includes a metal structure around the opening to enhance sealing, preventing contaminant entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protection layer is used to cover the substrate, then the substrate is protected from contaminants, but gaps form between the protection layer and tape due to height differences, allowing contaminants to enter through vent holes
Solution Approach 1:
The protection layer is designed with varying thicknesses: a first thickness in the region adjacent to the vent hole and a second thickness farther away. This local variation ensures that the protection layer maintains hermetic attachment to the tape at the critical vent hole region while providing adequate protection elsewhere, preventing gaps that would allow contaminant entry.
Solution Approach 2:
The patent introduces a vertical dimension variation in the protection layer thickness to solve a sealing problem. By increasing the thickness of the protection layer at specific locations (adjacent to vent holes), the invention creates a three-dimensional structure that ensures proper attachment to the tape and prevents contaminant ingress through the vent holes.
2Reliability
If the protection layer thickness is increased to ensure hermetic attachment, then sealing is improved, but the overall device height and complexity increase
Solution Approach 1:
Instead of uniformly increasing the protection layer thickness across the entire substrate, the invention applies increased thickness only in the specific region adjacent to the vent hole where hermetic attachment is critical. This localized approach achieves the required sealing without unnecessarily increasing overall device complexity or height.
Data Source
AI summary
A semiconductor package device comprises a substrate, an electronic component and a protection layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a first opening penetrating the substrate. The electronic component is disposed on the first surface of the substrate. The protection layer is disposed on the second surface of the substrate. The protection layer has a first portion adjacent to the first opening and a second portion disposed farther away from the first opening than is the first portion of the protection layer. The first portion of the protection layer has a surface facing away from the second surface of the substrate. The second portion of the protection layer has a surface facing away from the second surface of the substrate. A distance between the surface of the first portion of the protection layer and the second surface of the substrate is greater than a distance between the surface of the second portion of the protection layer and the second surface of the substrate.