Semiconductor Wafer Protection Tape for Image Sensor Yield
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Solution Overview
Problem
The manufacturing of semiconductor structures faces challenges in protecting the image-sensing region during the manufacturing process, leading to dust pollution and reduced yield rates, and the use of glass sheets for protection is costly and reduces light transmittance.
Innovation Solution
A method involving temporary bonding layers, carriers, ultraviolet tapes, and dicing tapes is employed to adhere and remove protective layers from the wafer, ensuring the image-sensing region is protected and easy to handle, while also enhancing the chip's sensing capability and eliminating the need for glass sheets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a glass sheet is used to cover the wafer surface for protection, then the image-sensing region is protected from dust, but material cost increases and light transmittance decreases
Solution Approach 1:
The patent uses a disposable protection tape made of inexpensive material to cover the image-sensing region during manufacturing. This tape is discarded after serving its protective purpose, replacing the expensive glass sheet while maintaining protection functionality throughout the manufacturing process
Solution Approach 2:
The patent employs a thin film protection tape that is flexible and can be easily applied to and removed from the wafer surface. This thin film provides adequate dust protection during manufacturing without the cost and light transmittance issues associated with glass sheets
2Illumination intensity
If the glass sheet is not disposed on the wafer surface, then light transmittance is improved, but the wafer becomes difficult to handle due to thinness
Solution Approach 1:
The patent introduces a carrier as an intermediary substrate that supports the thin wafer during manufacturing processes. This carrier provides mechanical strength and ease of handling to the otherwise fragile thin wafer, enabling smooth processing without compromising the wafer's thinness and light transmittance properties
3Loss of substance
If no protective element is used during manufacturing, then material cost is reduced, but the image-sensing region is polluted by dust and yield rate decreases
Solution Approach 1:
The patent uses an inexpensive, disposable protection tape that effectively prevents dust contamination during manufacturing. This low-cost protective measure significantly improves yield rate by keeping the image-sensing region clean throughout the manufacturing process
4Reliability
If a tape is used to cover the image-sensing region, then protection is provided, but the tape is difficult to remove after dicing
Solution Approach 1:
The patent employs a dynamic protection system where the protection tape is selectively applied and removed at different stages. The tape covers the image-sensing region during manufacturing when protection is needed, and is easily removed after dicing when it is no longer needed, providing adaptive protection throughout the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the yield rate of semiconductor structures by preventing dust pollution and enhancing the chip's sensing capability while reducing material costs by eliminating the need for glass sheets.
Implementation Method 1
Ultraviolet light is used to irradiate the ultraviolet tape, such that the adhesion of the ultraviolet tape is eliminated
Data Source
AI summary
A manufacturing method of a semiconductor structure includes the following steps. A temporary bonding layer is used to adhere a carrier to a first surface of a wafer. A second surface of the wafer is adhered to an ultraviolet tape on a frame, and the temporary bonding layer and the carrier are removed. A protection tape is adhered to the first surface of the wafer. An ultraviolet light is used to irradiate the ultraviolet tape. A dicing tape is adhered to the protection tape and the frame, and the ultraviolet tape is removed. A first cutter is used to dice the wafer from the second surface of the wafer, such that plural chips and plural gaps between the chips are formed. A second cutter with a width smaller than the width of the first cutter is used to cut the protection tape along the gaps.