Semiconductor Protection Tape with Intermediate Layer
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Solution Overview
Problem
Existing pressure-sensitive adhesive tapes for semiconductor protection face challenges in filling uneven surfaces and preventing adhesive residue, particularly with thermoplastic tapes that melt during grinding and acrylic tapes that are too soft to effectively adhere to bumps.
Innovation Solution
A pressure-sensitive adhesive tape with a specific configuration including a base material, an intermediate layer, and a pressure-sensitive adhesive layer, where the storage modulus of elasticity, thickness, and tack value satisfy a specific formula (A×(B/C)×D≥20 MPa·N), ensuring excellent followability and minimal adhesive residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a thermoplastic pressure-sensitive adhesive is used to improve followability to bumps through heating, then the adhesive can fill uneven surfaces better, but the adhesive melts due to grinding heat
Solution Approach 1:
The patent changes the chemical composition parameters of the pressure-sensitive adhesive from thermoplastic to acrylic-based adhesive with specific molecular weight and softening point ranges. This parameter change allows the adhesive to maintain its shape-stability and followability without melting under grinding heat, resolving the contradiction between heat resistance and bump-filling capability
Solution Approach 2:
The patent creates a composite pressure-sensitive adhesive system by combining acrylic polymer with specific additives and plasticizers in defined proportions. This composite structure achieves both the softness needed for bump followability and the thermal stability required to resist grinding heat, eliminating the trade-off between these properties
2Shape
If an acrylic pressure-sensitive adhesive is adjusted to be soft to fill bump unevenness, then the followability improves, but adhesive residue occurs after peeling
Solution Approach 1:
The patent precisely controls the molecular weight (50,000-500,000) and softening point (0-100°C) parameters of the acrylic pressure-sensitive adhesive. By optimizing these parameters within specific ranges, the adhesive achieves sufficient softness for bump followability while maintaining appropriate adhesion strength that prevents residue formation during peeling
Solution Approach 2:
The patent applies a controlled amount of plasticizer (5-50 parts by weight per 100 parts polymer) to achieve the desired balance between softness and residue prevention. This partial action approach ensures the adhesive is soft enough for bump filling but not so soft that it causes excessive residue, resolving the contradiction
Data Source
AI summary
Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (μm) of the intermediate layer, a thickness C (μm) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A×(B/C)×D≥20 (MPa·N).