Protective Structure for Semiconductor Crack Prevention
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Solution Overview
Problem
Microelectronic elements, such as integrated circuits or micro LEDs, using glass carriers often experience cracks during cutting or bonding due to stress or impact, affecting the structural reliability and quality of the product.
Innovation Solution
An electronic device design that includes a substrate with a first semiconductor element and a protective structure covering at least a portion of its surface, utilizing materials like silicone, acrylic, or epoxy to reduce crack expansion and prevent water and oxygen erosion, thereby enhancing structural reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass is used as a carrier for microelectronic elements, then the structural integrity is improved, but cracks occur at cutting edges or corners during cutting or bonding due to stress or impact
Solution Approach 1:
A protective structure is formed over the microelectronic element before cutting or bonding operations. This protective structure acts as a cushioning layer that absorbs stress and impact during subsequent processing steps, preventing cracks from forming at cutting edges or corners while maintaining the structural integrity of the glass carrier.
Solution Approach 2:
The protective structure is created in advance before the cutting or bonding processes. This preliminary protective layer is established to prevent damage during subsequent operations, ensuring that the microelectronic element and glass carrier remain intact throughout the manufacturing process.
2Reliability
If a protective structure is added to prevent cracks, then structural reliability is improved, but device complexity increases
Solution Approach 1:
The protective structure is implemented as a thin film or coating layer over the microelectronic element. This thin protective layer provides crack prevention and stress absorption without significantly increasing the overall device complexity or volume, maintaining a relatively simple structural configuration while improving reliability.
Data Source
AI summary
The disclosure provides an electronic device including a substrate, a first semiconductor element, and a first protective structure. The first semiconductor element is disposed on the substrate and electrically connected to the substrate. The first semiconductor element has a first surface away from the substrate. The first protective structure covers at least a portion of the first surface.