Semiconductor Device With Protruding Heat Sink Fin
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Solution Overview
Problem
Conventional power module semiconductor devices face challenges in achieving sufficient adhesion between the semiconductor package unit and the heat dissipating fin, leading to inadequate heat dissipation.
Innovation Solution
The semiconductor device incorporates an insulating sheet bonded to the heat dissipating fin with a protruding or recessed shape to improve positioning and fixation, combined with a heat spreader and transfer molding resin to enhance adhesion and heat dissipation, potentially eliminating the need for grease and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If grease is applied between the semiconductor package unit and heat dissipating fin to improve adhesion, then bonding is enhanced, but thermal resistance increases and heat dissipation is reduced
Solution Approach 1:
The invention extracts and eliminates the grease layer from the bonding interface between the semiconductor package unit and heat dissipating fin. By removing this intermediate substance, the patent achieves direct bonding between the insulating sheet and heat dissipating fin, thereby eliminating the thermal resistance barrier that grease created while maintaining sufficient adhesion through mechanical interlocking via protrusions and recesses.
Solution Approach 2:
The invention introduces an insulating sheet with protrusions and recesses as a mediator between the semiconductor package unit and heat dissipating fin. This insulating sheet serves dual functions: providing electrical insulation and creating mechanical interlocking through its protrusion-recess structure, thereby eliminating the need for grease while maintaining bonding strength.
2Strength
If holes for fastening are provided in the semiconductor package unit to bond it to the heat dissipating fin, then adhesion is improved, but device complexity increases
Solution Approach 1:
The invention extracts and eliminates the fastening holes from the semiconductor package unit. Instead of creating holes through the package unit for mechanical fastening, the patent uses surface protrusions and recesses on the heat dissipating fin that bond directly with the insulating sheet, thereby simplifying the overall structure while maintaining bonding strength.
Solution Approach 2:
Instead of modifying the semiconductor package unit by adding holes for fastening, the invention inverts the approach by providing protrusions and recesses on the heat dissipating fin surface. This reversal of the modification location simplifies the package unit structure while achieving the same bonding function through the insulating sheet's interaction with the fin's surface features.
3Strength
If grease is used to bond the semiconductor package unit and heat dissipating fin, then adhesion is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The invention implements preliminary action by pre-forming protrusions and recesses on the heat dissipating fin surface before the bonding process. These pre-formed geometric features automatically guide and constrain the positioning of the insulating sheet during assembly, eliminating the need for precise manual positioning that would be required when using grease bonding, thereby reducing manufacturing precision requirements.
Solution Approach 2:
The protrusion-recess structure on the heat dissipating fin provides self-aligning and self-positioning functionality during assembly. The geometric interlocking features automatically guide the insulating sheet into the correct position without requiring external positioning mechanisms or high-precision alignment procedures, thereby reducing manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the adhesion between the semiconductor package unit and the heat dissipating fin, leading to enhanced heat dissipation and increased reliability, while also allowing for miniaturization and cost reduction by eliminating the need for additional components like grease.
Implementation Method 1
The upper surface of the at least one heat dissipating fin has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet
Implementation Method 2
a transfer molding resin located to cover a predetermined surface including the upper surface of the at least one heat dissipating fin, the insulating sheet, the heat spreader and the power element
Implementation Method 3
a heat spreader located on the insulating sheet; a power element located on the heat spreader
Implementation Method 4
a heat dissipating fin; enhance heat dissipation
Data Source
AI summary
Provided is a semiconductor device including a heat dissipating fin; an insulating sheet bonded to an upper surface of the heat dissipating fin, with a part of the upper surface being exposed; a heat spreader located on the insulating sheet; a power element located on the heat spreader; and a transfer molding resin located to cover a predetermined surface including the part of the upper surface of the heat dissipating fin, the insulating sheet, the heat spreader and the power element, wherein the upper surface of the heat dissipating fin has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet.