Semiconductor Device Protruding Section Fillet Control
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Solution Overview
Problem
In semiconductor devices with flip-chip structures, the formation of a fillet with a prescribed width is challenging due to concave and convex sections on the chip surface, which restricts the design freedom and can lead to issues like increased electrical resistance and resin leakage, especially when the wiring direction is orthogonal to the resin advancing direction.
Innovation Solution
A semiconductor device with a protruding section that straddles convex sections on the chip surface, allowing the resin to flow into concave sections and extending beyond the bonding region, thereby adjusting the fillet width while preventing design restrictions, using materials like epoxy or polyimide and setting the protruding section height between 0.1 μm to 3 μm and convex section height between 15 μm to 25 μm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If concave and convex sections are formed on the chip surface according to wiring patterns, then wiring can be implemented, but the resin flow is restricted and fillet width cannot be controlled
Solution Approach 1:
The chip surface is segmented into concave and convex sections according to wiring patterns. The protruding section is strategically positioned to span across convex sections, creating a resin flow path that is segmented but controlled. This segmentation allows wiring to follow the convex sections while the protruding section guides resin flow into concave areas, ensuring both wiring integrity and fillet formation.
Solution Approach 2:
The protruding section acts as an intermediary structure between the convex wiring sections and the resin flow. It provides a bridge that directs resin from the injection point through convex sections into concave sections, mediating the interaction between wiring requirements and resin filling needs. This intermediary structure enables controlled resin distribution without compromising wiring integrity.
2Ease of operation
If the protruding section height is increased to guide resin flow, then resin can be directed into concave sections, but the structure becomes more complex and may affect bump bonding
Solution Approach 1:
The protruding section height is optimized within a specific range (0.1 μm to 3 μm) to achieve the desired resin flow guidance while maintaining structural simplicity. This parameter optimization ensures that the protruding section is tall enough to guide resin flow into concave sections but not so tall as to create excessive complexity or interfere with bump bonding operations. The height parameter is carefully controlled to balance flow guidance effectiveness with structural simplicity.
3Reliability
If resin is injected to fill spaces between bumps, then bonding reliability is improved, but resin may leak outside the bonding region forming excessive fillet
Solution Approach 1:
The chip surface is given different local qualities through the protruding section structure. The protruding section creates a local barrier that confines resin within the bonding region while allowing controlled leakage into concave sections to form the fillet. This local quality differentiation ensures that resin filling for bonding reliability is achieved while fillet width is simultaneously controlled, preventing excessive resin leakage outside the bonding region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of a fillet with a prescribed width, preventing resin leakage and ensuring reliable bonding without compromising the degree of design freedom, even when the wiring direction is orthogonal to the resin advancing direction.
Implementation Method 1
The resin 104 penetrates the spaces between the bumps 103 (spaces between bumps) by a capillary phenomenon, and the clearance between the lower chip 101 and the upper chip 102 is sealed.
Implementation Method 2
the resin 104, which has advanced into the spaces between the bumps by a capillary phenomenon, will also leak out to the outside of the bonding region of the lower chip 101 and the upper chip 102. In this way, a fillet 105 is formed
Data Source
AI summary
A semiconductor device including a first semiconductor chip and a second semiconductor chip which are bump bonded to each other with a clearance therebetween sealed with resin injected from a prescribed position on the first semiconductor chip in a manner that a space between bumps formed by bump bonding is filled with the resin, and a plurality of concave and convex sections which are formed on a surface side of the first semiconductor chip, the surface being bonded with the second semiconductor chip, and have a protruding section which straddles at least one convex section out of convex sections of the plurality of concave and convex sections formed in a surrounding section of a bonding region between the first semiconductor chip and the second semiconductor chip.