Semiconductor Pump System with Temperature-Controlled Fluid Pipe

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Solution Overview

Problem

Conventional pump systems for semiconductor chambers face issues such as powder by-product accumulation due to gas expansion, rotor overheating, and inefficient gas processing, leading to reduced pump performance and durability, as well as high costs and maintenance challenges associated with plasma equipment.

Innovation Solution

A pump system with a heating/cooling unit in the fluid pipe connecting the roots-type and screw-type rotors to control gas temperature and a small-scale plasma unit for efficient gas decomposition, allowing for optimal temperature control and improved gas processing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by stationary object

If a roots-type rotor and screw-type rotor are used to maintain vacuum state and save power, then power cost is reduced, but compressed gases expand instantaneously causing temperature decrease and pressure increase, solidifying gases into powder by-products that accumulate in the screw-type rotor and damage the screw, reducing pump lifetime

Engineering Contradiction:

Improvepower costVSAvoidpump lifetime

Core Design Contradiction:

Use of energy by stationary objectVSReliability

Solution Approach 1:

The patent introduces a heating unit that heats the fluid pipe through which compressed gas flows from the roots-type rotor to the screw-type rotor. By controlling the temperature parameter of the gas during transport, the patent prevents the gas from cooling and solidifying into powder by-products, thereby preventing accumulation and damage to the screw-type rotor while maintaining the energy-efficient dual-rotor configuration

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The heating unit applies a preliminary anti-action by pre-heating the compressed gas before it enters the screw-type rotor. This prevents the harmful effect of gas cooling and solidification in advance, stopping the formation of powder by-products before they can accumulate and damage the rotor

Inventive Principle:

Principle #9Preliminary anti-action

2Stress or pressure

If the pump for the load lock chamber compresses atmosphere to maintain proper pressure, then chamber pressure control is achieved, but high temperature compression heat is generated causing excessive rotor expansion and contact interference with housing wall, leading to rotor damage and reduced operation performance

Engineering Contradiction:

Improvechamber pressureVSAvoidrotor operation performance

Core Design Contradiction:

Stress or pressureVSReliability

Solution Approach 1:

The patent introduces a cooling unit that cools the fluid pipe through which compressed gas flows. By controlling the temperature parameter of the gas during compression and transport, the patent prevents excessive rotor expansion and contact interference with the housing wall, thereby protecting the rotor from damage and maintaining operation performance while achieving proper chamber pressure control

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents powder accumulation, reduces rotor damage, enhances pump performance and durability, and lowers costs by maintaining optimal temperatures and efficiently processing gases, including perfluorocarbon, without the need for high-temperature scrubbers.

Implementation Method 1

a heating/cooling unit including a heater or a cooler, or a combination thereof, is provided to the pipe between the roots-type rotor section and the screw-type rotor section to heat or cool gases flowing from a roots-type rotor towards a screw-type rotor

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 2

Methodology Applied

Scientific EffectCooling: Cooling

Implementation Method 3

a small-scale plasma unit for inducing a plasma reaction is provided to a small-diameter (18 ̃25 mm) fluid pipe connecting a roots-type rotor section and a screw-type rotor section so as to implement a by-product gases-processing system able to efficiently decompose and process gases flowing through the fluid pipe

Methodology Applied

Scientific EffectPlasma decomposition: Plasma

Data Source

PatentUS11353023B2Pump system for semiconductor chamber

Publication Date: 2022.06.07 SP PLAN CO LTD

AI summary

Disclosed is a pump system for a semiconductor chamber includes a housing having a front chamber and a rear chamber, a roots-type rotor provided to the front chamber of the housing, a screw-type rotor provided to the rear chamber, a shaft member coupled through the roots-type rotor and the screw-type rotor, and a driving motor provided to the outside of the housing in such a way as to be axially connected to the shaft member to provide power for driving the rotors. A fluid pipe is provided to the outside of the housing to connect the front chamber and the rear chamber. The fluid pipe is provided with a heater and/or a cooler to heat or cool the fluid flowing through the fluid pipe.