Semiconductor Radiation Source Planar Capacitor Integration
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Solution Overview
Problem
Existing semiconductor radiation sources face challenges in operating with high currents due to increased inductance in the current path, which limits pulse rise times and efficiency, especially in applications requiring short light pulses.
Innovation Solution
A semiconductor radiation source design that stacks a semiconductor chip directly on top of a capacitor body, eliminating bond wires and conductor tracks to minimize inductance, using the capacitor body as both a mounting platform and energy storage for short laser pulses, allowing for direct planar electrical connections and reduced inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional mounting methods with bond wires and conductor tracks are used, then electrical connections can be established, but inductance increases limiting pulse rise times
Solution Approach 1:
The patent removes bond wires and conductor tracks from the electrical connection path between capacitor and semiconductor chip. By extracting these intermediate elements, the inductance is minimized and pulse rise time is improved, achieving direct planar electrical contact between the capacitor body and chip.
Solution Approach 2:
The capacitor body is merged with the mounting platform function, creating a single integrated component that serves both as energy storage and mechanical support. This consolidation eliminates the need for separate mounting structures and conductor tracks, reducing inductance and simplifying the overall device architecture.
2Strength
If capacitor body is used for mounting, then structural support is provided, but inductance in current path increases
Solution Approach 1:
The capacitor body combines structural support and energy storage functions in a single component. The mounting platform is integrated into the capacitor body structure, providing mechanical strength while maintaining low inductance through direct planar contact geometry.
Solution Approach 2:
The electrical connection transitions from three-dimensional wire paths to two-dimensional planar contact. This dimensional change reduces the current path length and inductance while maintaining structural integrity through the planar interface between capacitor and chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables high current intensities and shorter radiation pulses with increased efficiency, suitable for applications like automotive headlamps and time-of-flight systems, while maintaining a compact size and reduced costs.
Implementation Method 1
at least one capacitor body, wherein the semiconductor chip directly electrically connects in a planar manner to the capacitor body
Data Source
AI summary
A semiconductor radiation source includes at least one semiconductor chip that generates radiation; and at least one capacitor body, wherein the semiconductor chip and the capacitor body are stacked on top of each other, the semiconductor chip directly electrically connects in a planar manner to the capacitor body, the semiconductor chip is a ridge waveguide laser, and a ridge waveguide of the semiconductor chip is arranged on a side of the semiconductor chip facing away from the capacitor body.