Semiconductor Device Radiation Vias Heat Dissipation
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Solution Overview
Problem
Existing semiconductor devices have insufficient heat radiation due to a small heat transferable region on the printed circuit board, limiting the effective dissipation of heat generated by electronic components.
Innovation Solution
A semiconductor device design featuring a printed board with radiation vias in both overlapping and non-overlapping regions, cross-connected conductor layers, and a diffusion radiator consisting of a thermal diffusion plate, radiation member, and cooling body, which enhances heat diffusion and radiation by expanding the heat transfer area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal conduction channel is formed only in a portion of the printed circuit board away from immediately below the electronic component, then the structural integrity of the printed circuit board is maintained, but the heat radiation is insufficient in the region from the electronic component to the heat sink
Solution Approach 1:
The printed circuit board is divided into multiple regions: a first region immediately below the electronic component containing first radiation vias, and a second region away from the electronic component containing second radiation vias. This segmentation allows heat to be conducted through multiple distributed paths, increasing the overall heat transferable area while maintaining structural integrity in different zones of the board.
Solution Approach 2:
The invention transitions from a single-point thermal conduction channel to a multi-dimensional heat transfer network by forming radiation vias in both the first region (directly below component) and second region (away from component). This creates a three-dimensional heat diffusion pathway through the printed circuit board, significantly expanding the heat transferable region area and improving heat radiation efficiency.
2Temperature
If a thermal conduction hole is made only immediately below the electronic component, then the heat transfer path is direct and short, but the area of heat transferable region is limited and heat radiation is insufficient
Solution Approach 1:
The thermal conduction function is segmented into multiple radiation vias distributed across two regions (first region directly below component, second region away from component) rather than using a single thermal conduction hole. This segmentation increases the heat transferable area and improves heat radiation efficiency while distributing the structural modifications across different zones.
Solution Approach 2:
The invention merges the functions of multiple radiation vias (both first and second radiation vias) with the existing conductor layers of the printed circuit board. The conductor layers cross-connect to the radiation vias, creating an integrated heat transfer network that combines electrical conduction paths with thermal conduction paths, thereby improving heat radiation without proportionally increasing device complexity.
3Temperature
If radiation vias are formed in both first region overlapping the electronic component and second region outside the first region, then the heat transfer area is expanded and heat radiation is improved, but the printed circuit board structure becomes more complex
Solution Approach 1:
The invention creates a three-dimensional heat transfer network by forming radiation vias in both the first region (directly below component) and second region (away from component), utilizing the vertical dimension of the printed circuit board. This multi-layer via structure expands the heat transferable region area by creating distributed thermal pathways throughout the board thickness, significantly improving heat radiation efficiency.
Solution Approach 2:
The conductor layers in the printed circuit board serve dual functions: electrical conduction and thermal conduction. By making the conductor layers cross-connect to both first and second radiation vias, the same conductor layers participate in both electrical circuitry and heat transfer, thereby expanding the heat transferable region area without adding separate dedicated thermal structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves heat radiation efficiency by radially diffusing heat around electronic components, reducing thermal resistance by approximately 25% compared to conventional designs, thereby enhancing the cooling capacity of semiconductor devices.
Implementation Method 1
A thermal conduction channel is formed in the printed circuit board so as to penetrate the printed circuit board from one of main surfaces to the other main surface. The heat generated from the electronic components is transferred to the heat sink through the thermal conduction channel
Implementation Method 2
a diffusion radiator below the printed board... comprising a thermal diffusion plate, a radiation member, and a cooling body... the radiation member is in close contact with one of main surfaces of the cooling body
Data Source
AI summary
A printed board includes an insulating layer, and radiation vias penetrating printed board are formed in both a first region overlapping electronic component and a second region outside the first region. A plurality of conductor layers included in printed board are cross-connected to a plurality of radiation vias. Diffusion radiator includes a thermal diffusion plate, a radiation member, and a cooling body. Radiation member is in close contact with one of main surfaces of cooling body, and thermal diffusion plate is in close contact with one of main surfaces of radiation member on the opposite side to cooling body. One of main surfaces of thermal diffusion plate on the opposite side to radiation member is bonded to a conductor layer on the other main surface of printed board so as to close the plurality of radiation vias.