Semiconductor Radiator Groove-Projection Thermal Interface
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Solution Overview
Problem
The miniaturization of semiconductor devices is hindered by the need for a fixing region and complex manufacturing processes due to the use of heat sinks, which can lead to inadequate heat conduction and increased costs, and are prone to point or line contact issues caused by substrate warping.
Innovation Solution
A semiconductor device design featuring a first radiator member with grooves and a second radiator member with projections that fit into these grooves, allowing for direct attachment without additional fixing tools and ensuring a wide contact area for efficient heat conduction, thereby simplifying manufacturing and maintaining effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a heat sink is fixed to the mounting substrate, then heat radiation efficiency is improved, but device miniaturization is hindered due to the need for a fixing region
Solution Approach 1:
The invention merges the heat sink base with the radiator plate by directly forming the heat sink base on the radiator plate surface. This integration eliminates the need for separate fixing regions on the mounting substrate, as the heat sink is self-supported through the thermal conduction path from the semiconductor element to the radiator plate.
2Reliability
If a fixing tool such as a screw or adhesive is used to fix the heat sink, then the heat sink is securely attached, but the manufacturing steps are complicated and manufacturing cost increases
Solution Approach 1:
The heat sink base is designed to be self-formed on the radiator plate through the existing thermal conduction structure. The semiconductor element itself serves as the fixing mechanism by transmitting heat force that securely attaches the heat sink base to the radiator plate, eliminating the need for external fixing tools or adhesives.
3Stability of the object's composition
If the mounting substrate warps due to heat contraction, then the radiator plate and heat sink may make point or line contact, but sufficient heat conduction cannot be carried out
Solution Approach 1:
The heat sink base is designed with flexibility to adapt to substrate warping. By forming the heat sink base directly on the radiator plate without rigid external fixings, the structure can dynamically accommodate dimensional changes in the mounting substrate while maintaining continuous thermal contact through the heat conduction path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables miniaturization of semiconductor devices, ensures reliable heat conduction, and simplifies the manufacturing process by eliminating the need for additional fixing components, while maintaining efficient heat dissipation and preventing temperature rise.
Implementation Method 1
a second radiator member arranged on the first radiator member and thermally coupled to the first radiator member
Implementation Method 2
radiated to the atmosphere through the heat sink 74
Implementation Method 3
heat radiation fins 73
Data Source
AI summary
A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, a first radiator member arranged on and thermally coupled to the semiconductor element, and a second radiator member arranged on and thermally coupled to the first radiator member. The second radiator member includes projections which project out toward the first radiator member. The projections are formed on a circumference of a concentric circle with respect to a center point of the second radiator member. The first radiator member includes grooves in which the projections are movable. The grooves are formed on a circumference of a concentric circle with respect to a center point of the first radiator member. The projections are fitted to terminating ends of the grooves with the center point of the first radiator member and the center point of the second radiator member coincided.