Semiconductor Apparatus Raised Positioning Part Wire Bonding
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Solution Overview
Problem
In semiconductor apparatus manufacturing, wire bonding precision is compromised due to errors in recognizing reference points, leading to reduced wire connection strength and increased risk of wire separation during reliability testing.
Innovation Solution
Incorporating a raised positioning part within the case member as a reference point for wire bonding, distinct from the location of burrs caused by monolithic molding, allows for improved positional accuracy and bonding strength by enabling clear distinction from image recognition errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If image recognition technology is used to detect bonding location automatically, then automation is improved, but measurement precision deteriorates due to error in recognition of reference point
Solution Approach 1:
A marker is introduced as an intermediary reference object that is easily recognizable by the image recognition system. The marker serves as a mediator between the automation system and the bonding location, providing a clear reference point that improves measurement precision while maintaining automation. The marker is positioned in the vicinity of the bonding location and has distinct visual characteristics that facilitate accurate detection.
2Productivity
If wire bonding is performed with positional error, then manufacturing speed is maintained, but reliability deteriorates due to reduced wire connection strength
Solution Approach 1:
The marker is positioned in advance in the vicinity of the bonding location, allowing the image recognition system to accurately determine the bonding position before the actual wire bonding operation. This preliminary positioning ensures that the correct bonding location is identified, maintaining both manufacturing speed and wire connection strength by preventing positional errors.
3Device complexity
If monolithic molding is used for case member and control terminal, then manufacturing complexity is reduced, but manufacturing precision deteriorates due to burr formation
Solution Approach 1:
The marker is intentionally designed with a shape that may resemble burrs but is clearly distinguishable through image recognition. This converts the potential harm of burr-like features into a benefit by creating a recognizable reference point. The marker's distinctive shape allows the system to differentiate between actual defects and the intentional reference feature, maintaining manufacturing precision while preserving the simplicity of monolithic molding.
Data Source
AI summary
A semiconductor apparatus includes a semiconductor element, a control terminal electrically connected to a top electrode of the semiconductor element through a wiring member, and a case member in which at least a portion of the control terminal is embedded and which defines a space for housing the semiconductor element. The control terminal includes a pad to which the wiring member is connected. The case member includes a wiring member positioning part raised on the case member as a reference point for a positioning of the wiring member before a connection is made of the wiring member to the pad.