Semiconductor Thermal Dissipation via RDL and Conductive Vias
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Solution Overview
Problem
Conventional semiconductor devices face challenges in effectively dissipating heat, which can lead to reduced longevity and performance due to the need for dedicated thermal conduction structures that increase cost and size.
Innovation Solution
The semiconductor device incorporates conductive vias and thermally conductive layers to create a thermal dissipation path, utilizing redistribution layers (RDLs) and conductive vias to facilitate heat dissipation without the need for additional structural components, thereby reducing size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks with dedicated thermal conduction structures are used, then thermal dissipation is achieved, but package size and cost increase
Solution Approach 1:
The patent merges electrical interconnect functions with thermal dissipation functions by using the same conductive vias and redistribution layers for both purposes. The conductive vias that provide electrical connection between die and substrate also serve as thermal conduction paths, eliminating the need for separate dedicated thermal structures.
Solution Approach 2:
The conductive vias and metal layers are designed to perform multiple functions simultaneously: electrical interconnection and thermal conduction. This multi-functionality allows the package to dissipate heat effectively without adding dedicated thermal management components, thereby reducing overall package size.
2Temperature
If conventional heat sinks with dedicated thermal conduction structures are used, then thermal dissipation is achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines thermal dissipation functionality with existing electrical interconnect structures (conductive vias and redistribution layers), eliminating the need for separate thermal conduction structures. This integration reduces manufacturing complexity and cost by using the same fabrication processes for both electrical and thermal functions.
Solution Approach 2:
The conductive vias and metal layers are designed to perform multiple functions simultaneously: electrical interconnection and thermal conduction. This multi-functionality allows the package to dissipate heat effectively without adding dedicated thermal management components, thereby reducing overall package size.
3Productivity
If the semiconductor device structure is simplified to reduce size and cost, then manufacturing efficiency improves, but thermal dissipation capability may be compromised
Solution Approach 1:
The patent combines thermal dissipation functionality with existing electrical interconnect structures (conductive vias and redistribution layers), eliminating the need for separate thermal conduction structures. This integration reduces manufacturing complexity and cost by using the same fabrication processes for both electrical and thermal functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation from semiconductor devices, improving their longevity and performance while minimizing the need for dedicated thermal structures, thus reducing overall package size and cost.
Implementation Method 1
a thermal dissipation path through the thermally conductive layer, the first conductive layer, and the conductive via
Data Source
AI summary
A semiconductor device has a conductive via formed around a perimeter of the semiconductor die. First and second conductive layers are formed on opposite sides of the semiconductor die and thermally connected to the conductive via. An insulating layer is formed over the semiconductor die. Openings in the insulating layer expose the first conductive layer and a thermal dissipation region of semiconductor die. A thermal via is formed through the insulating layer to the first conductive layer. A thermally conductive layer is formed over the thermal dissipation region and thermal via. A thermal conduction path is formed from the thermal dissipation region through the thermally conductive layer, thermal via, first conductive layer, conductive via, and second conductive layer. The thermal conduction path terminates in an external thermal ground point. The thermally conductive layer provides shielding for electromagnetic interference.