Semiconductor Recess Bridge Interconnect for Signal Integrity
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Solution Overview
Problem
Conventional recess-in-motherboard (RiMB) semiconductor designs increase transmission line distance, leading to power loop inductance and channel impedance discontinuities, which degrade signal and power integrity by introducing reflection noise and performance issues.
Innovation Solution
A recess by-pass interconnect, or 'bridge', using decoupling capacitors and a solder layer to connect the semiconductor package directly to the PCB on the opposite side, reducing transmission line length and avoiding non-ideal vertical transitions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional transmission lines run from semiconductor dies through printed circuit boards, then electrical connections are established, but transmission line distance increases causing power loop inductance and channel impedance discontinuities
Solution Approach 1:
The patent transitions from vertical transmission lines (through PCB layers) to lateral transmission lines (along PCB surface), changing the dimensional path of signal transmission. This lateral routing approach reduces the effective transmission distance and eliminates impedance discontinuities associated with vertical transitions through multiple PCB layers.
Solution Approach 2:
The invention extracts the transmission line path from the conventional vertical route through PCB layers and repositions it laterally along the PCB surface. By separating the transmission function from the vertical interconnect structure, the patent eliminates the harmful impedance discontinuities and reduces overall transmission distance.
2Volume of moving object
If recess-in-motherboard design is used, then miniaturization is achieved, but transmission line distance increases leading to reflection noise and performance degradation
Solution Approach 1:
The patent resolves the conflict between miniaturization and signal integrity by changing the transmission line orientation from vertical to lateral. This dimensional change allows the transmission path to be optimized independently of the vertical package height, enabling miniaturized designs to maintain short transmission distances and avoid reflection noise.
3Reliability
If vertical transitions through PCB are used, then electrical connections are established, but channel impedance discontinuities occur causing reflection noise
Solution Approach 1:
The invention extracts the transmission line from the complex vertical transition path through multiple PCB layers and repositions it laterally. This eliminates the impedance discontinuities caused by vertical transitions while simplifying the overall transmission path structure.
Data Source
AI summary
An electronic device is disclosed. In one example, the electronic device includes a circuit board comprising a recess a package in the recess, a semiconductor die coupled to the first side of the package, and a bridge extending from the first side of the package to the circuit board wherein the bridge electrically couples the package to the circuit board.