Semiconductor Recess for Inductor Coupling Precision

Solution Overview

Problem

The challenge in semiconductor devices is to shorten the distance between inductors for improved communication precision while maintaining the physical protection function of the sealing resin layer, which is compromised by thickening the resin layer to reduce the distance between inductors.

Innovation Solution

A recess or opening is formed in the sealing resin layer to house the inductor, allowing for a thinner resin layer elsewhere to maintain protection functions, thereby reducing the distance between the inductor on the semiconductor chip and an external inductor without compromising physical protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the sealing resin layer is made thick to ensure physical protection function, then the protection function is improved, but the distance between inductors is increased reducing communication precision

Engineering Contradiction:

Improvephysical protection functionVSAvoidcommunication precision

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

The sealing resin layer is designed with non-uniform thickness: a first thickness in the first region (above semiconductor chip) ensuring protection, and a second thickness (smaller than first) in the second region (above mounting board) reducing distance. This local differentiation resolves the contradiction by providing thick protection where needed while minimizing distance where communication occurs.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The solution transitions from uniform thickness (one-dimensional) to variable thickness (spatially differentiated) in the sealing resin layer. By introducing dimensional variation in the resin layer thickness across different regions, the patent simultaneously achieves both protection (thick region) and communication precision (thin region).

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Measurement precision

If the sealing resin layer is made thin to reduce distance between inductors, then communication precision is improved, but the physical protection function is compromised

Engineering Contradiction:

Improvecommunication precisionVSAvoidphysical protection function

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The sealing resin layer is designed with non-uniform thickness: a first thickness in the first region (above semiconductor chip) ensuring protection, and a second thickness (smaller than first) in the second region (above mounting board) reducing distance. This local differentiation resolves the contradiction by providing thick protection where needed while minimizing distance where communication occurs.

Inventive Principle:

Principle #3Local quality

3Measurement precision

If the distance between inductors is shortened to improve communication precision, then communication precision is improved, but the sealing resin layer thickness must be reduced compromising protection

Engineering Contradiction:

Improvecommunication precisionVSAvoidsealing resin layer thickness

Core Design Contradiction:

Measurement precisionVSLength of stationary object

Solution Approach 1:

The sealing resin layer is designed with non-uniform thickness: a first thickness in the first region (above semiconductor chip) ensuring protection, and a second thickness (smaller than first) in the second region (above mounting board) reducing distance. This local differentiation resolves the contradiction by providing thick protection where needed while minimizing distance where communication occurs.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively shortens the inductive coupling distance while ensuring the physical protection and insulation functions of the sealing resin layer, enhancing communication precision and handling ease.

Implementation Method 1

performing communication between a semiconductor device and the outside wirelessly by providing an inductor in a semiconductor chip and making the inductor inductively coupled to an external inductor

Methodology Applied

Scientific EffectInductive coupling: Electromagnetic Induction

Data Source

PatentUS8810021B2Semiconductor device including a recess formed above a semiconductor chip

Publication Date: 2014.08.19 RENESAS ELECTRONICS CORP

AI summary

A semiconductor device, includes a substrate with a first surface, a semiconductor chip disposed over the first surface of the substrate, the semiconductor chip including a first region and a second region, and an encapsulant resin formed over the first surface of the substrate and encapsulating the semiconductor chip. The encapsulant resin has a thickness that is less at the first region of the semiconductor chip than that at the second region.