Semiconductor Package Recess Pattern Embeds Metal Line
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing miniaturization of electronic devices requires a cost-effective method for fabricating semiconductor packages without relying on expensive photo equipment, as existing methods are costly and complex.
Innovation Solution
A semiconductor package design featuring a semiconductor chip with a bonding pad, metal line, insulation layer, and molding layer, where the metal line is embedded in a recess pattern within the molding layer to contact the bonding pad and external terminal, eliminating the need for a printed circuit board and bonding wires, and using a laser stop layer to protect the bonding pad during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a photo process using photo equipment is used to fabricate semiconductor packages, then manufacturing precision and reliability are improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent extracts and eliminates the photo process step from the fabrication sequence, replacing it with a direct molding layer formation process. The molding layer is formed to include recess patterns that directly expose bonding pads and create metal line pathways without requiring photo equipment or photoresist processing, thereby simplifying the overall fabrication process while maintaining precision.
Solution Approach 2:
The molding layer is segmented into functional regions including recess patterns, via holes, and metal line embedding zones. This segmentation allows different portions of the molding layer to serve specific functions: protecting bonding pads, providing metal line pathways, and enabling electrical connections, thereby achieving complex functionality through a simplified single-layer structure.
2Manufacturing precision
If photo equipment is used for fabricating semiconductor packages, then manufacturing precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive photo equipment with a cost-effective molding layer formation process. The molding layer itself acts as a disposable protective structure that is formed through economical means (such as screen printing or direct molding) and serves multiple functions including bonding pad protection, metal line embedding, and electrical insulation, thereby eliminating the need for costly photo processing equipment.
3Reliability
If bonding wires or bumps are used to electrically connect semiconductor chips, then electrical connection is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the electrical connection function with the molding layer structure itself. The molding layer includes integrated recess patterns and via holes that directly provide electrical pathways from bonding pads to external terminals, eliminating the need for separate bonding wires or bumps. This integration simplifies the package structure while maintaining reliable electrical connections.
Solution Approach 2:
The molding layer is designed to perform multiple functions simultaneously: it protects bonding pads, provides electrical insulation, creates electrical connection pathways through recess patterns and via holes, and supports external terminals. This multi-functionality eliminates the need for separate bonding wires or bumps, reducing device complexity while maintaining connection reliability.
4Ease of manufacture
If the package structure is simplified to reduce manufacturing cost, then manufacturing cost decreases, but solder joint reliability may worsen
Solution Approach 1:
The patent applies local quality by creating recess patterns in the molding layer at specific locations where metal lines need to be embedded. These recess patterns provide localized enhanced contact areas between solder balls and metal lines, improving solder joint reliability only where needed, while the rest of the molding layer maintains its simplified protective function, thereby balancing cost reduction with reliability enhancement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and improves solder joint reliability by increasing the contact area between the solder ball and metal line, simplifying the package structure and enhancing mechanical and electrical characteristics.
Implementation Method 1
a laser stop layer to protect the bonding pad during processing
Implementation Method 2
a laser stop layer to protect the bonding pad during processing
Data Source
AI summary
Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a semiconductor chip having a bonding pad, a metal line electrically connected to the semiconductor chip and having a terminal contacting an external terminal, an insulation layer covering the metal line and having an opening that defines the terminal, and a molding layer molding the semiconductor chip, wherein the molding layer includes a recess pattern exposing the bonding pad and extending from the bonding pad to the terminal, and the metal line is embedded in the recess pattern to contact the bonding pad.