Semiconductor Device Recess Protrusion Adhesive Stability
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Solution Overview
Problem
The quality of semiconductor devices can degrade due to the condition of the conductive adhesive connecting the leadframe and connectors, leading to potential displacement and breakage of the adhesive during reflow, which affects the reliability and performance of the device.
Innovation Solution
The semiconductor device design incorporates a recess and protrusion configuration on the second leadframe and connector, where the protrusion is housed within the recess, ensuring that the conductive adhesive maintains a consistent thickness and reduces the likelihood of breakage by increasing the length between transverse ends, thereby preventing displacement and enhancing stability during reflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive adhesive is used to connect the leadframe and connectors, then electrical connection is achieved, but the adhesive may be displaced or broken during reflow, degrading device quality
Solution Approach 1:
The connecting face is divided into multiple regions: a first region with the conductive adhesive and a second region without the adhesive. This segmentation allows the adhesive to be confined to a specific area, preventing displacement during reflow while maintaining electrical connection reliability.
Solution Approach 2:
The connecting face has non-uniform properties: the first region contains conductive adhesive for electrical connection, while the second region is adhesive-free. This local differentiation optimizes both electrical connectivity and mechanical stability by placing adhesive only where needed for conduction, reducing overall displacement risk.
2Reliability
If the conductive adhesive connects the leadframe and connectors, then electrical connection is established, but the adhesive thickness may vary, affecting connection quality
Solution Approach 1:
The connecting face is pre-processed to create a distinct first region where conductive adhesive will be applied. This preliminary region definition ensures that adhesive is deposited only in the designated area with controlled thickness, improving manufacturing precision before the actual bonding process.
3Reliability
If the connector is connected to the leadframe with conductive adhesive, then electrical connection is achieved, but the connection may degrade during reflow processes
Solution Approach 1:
The connecting face is designed with a restricted first region for adhesive application, creating a buffer zone that prevents adhesive overflow and displacement during thermal expansion in reflow. This beforehand structural design cushions against the harmful effects of reflow heating, maintaining connection durability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents the conductive member from being displaced from its desired position and reduces the risk of adhesive breakage, ensuring the semiconductor device maintains quality and reliability by maintaining a consistent adhesive thickness and distribution.
Implementation Method 1
The second face connected to the first face with a conductive adhesive
Data Source
AI summary
A semiconductor device according to one embodiment includes a first leadframe, a second leadframe, a semiconductor chip, and a conductive member. The second leadframe has a first face provided with a recess and is separated from the first leadframe. The semiconductor chip is mounted on the first leadframe. The conductive member has a second face connected to the first face with a conductive adhesive, the second face provided with a protrusion housed in the recess at least partially, and the conductive member electrically connected the semiconductor chip and the second leadframe to each other. The recess and the protrusion are longer in a first direction in which the first face extends than in a second direction along the first face and orthogonal to the first direction.