Semiconductor Recess Sensor Assembly for Precise Junction Temperature Sensing

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Solution Overview

Problem

The placement of temperature sensors in half-bridge switch arrangements is challenging due to mechanical and spatial restrictions, as well as electrical insulation requirements.

Innovation Solution

A specially designed temperature sensor unit is integrated with a semiconductor component having a recess, allowing the sensor to be positioned close to the junction and minimizing environmental influences.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a temperature sensor is placed close to the semiconductor junction to improve measurement precision, then measurement precision is improved, but mechanical and spatial restrictions as well as electrical insulation requirements make the placement difficult

Engineering Contradiction:

Improvetemperature measurement precisionVSAvoidsensor placement ease

Core Design Contradiction:

Measurement precisionVSEase of operation

Solution Approach 1:

The temperature sensor unit is nested within the semiconductor component's recess. The sensor unit comprises a housing element with a first housing section and a second housing section, where the second housing section fits into the recess of the semiconductor component, allowing the sensor element to be positioned close to the junction while maintaining mechanical stability and electrical insulation.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The housing element acts as an intermediary structure between the temperature sensor element and the semiconductor component. It provides mechanical support, electrical insulation, and thermal coupling, enabling the sensor to be placed close to the junction without direct contact that would compromise electrical isolation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If the temperature sensor unit is designed with a compact structure to simplify the arrangement, then device complexity is reduced, but maintaining low thermal resistance becomes more challenging

Engineering Contradiction:

Improvesensor unit structure complexityVSAvoidthermal coupling reliability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The housing element is segmented into a first housing section and a second housing section. The second housing section is specifically designed to fit into the recess of the semiconductor component, creating a compact yet thermally efficient structure that maintains low thermal resistance while simplifying the overall arrangement.

Inventive Principle:

Principle #1Segmentation

3Loss of energy

If the second housing section fits exactly into the recess to minimize thermal resistance, then heat conduction is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvethermal resistanceVSAvoidhousing section fit precision

Core Design Contradiction:

Loss of energyVSManufacturing precision

Solution Approach 1:

The second housing section is designed with specific local geometric properties to complement the recess shape. This localized precision fitting ensures minimal thermal resistance at the critical interface between the sensor unit and semiconductor component, while the overall structure remains manufacturable with standard tolerances.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables precise and reliable temperature measurement for overtemperature protection and power reduction, while simplifying the sensor's arrangement and reducing thermal resistance.

Implementation Method 1

The temperature sensor unit has a housing element and a temperature sensor element, wherein the temperature sensor element is arranged at least partially in the second housing section

Methodology Applied

Scientific EffectThermal energy detection: Thermistor

Implementation Method 2

the second housing section fits into the recess, in particular it fits exactly, i.e. the second housing section and the recess are complementary, in order to keep a thermal resistance between the semiconductor component and the temperature sensor unit as small as possible

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250052623A1Assembly comprising a semiconductor component and a temperature sensor unit for measuring a temperature of the semiconductor component, and switch arrangement

Publication Date: 2025.02.13 SEG AUTOMOTIVE GERMANY GMBH

AI summary

An assembly includes a semiconductor component and a temperature sensor unit for measuring a temperature of the semiconductor component, wherein the semiconductor component comprises a recess, wherein the temperature sensor unit comprises a housing element and a temperature sensor element, wherein the housing element comprises a first housing section and a second housing section, wherein the second housing section protrudes from the first housing section, wherein the temperature sensor element is at least partially located in the second housing section, the second housing section projecting from the first housing section, the temperature sensor element being arranged at least partially in the second housing section, the second housing section being arranged in the recess of the semiconductor component, and a switch arrangement having at least one such assembly and at least one further semiconductor component.