Semiconductor Assembly Recess Layout to Prevent Solder Ball Shift
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Solution Overview
Problem
The use of spherical solder balls in semiconductor device production can lead to displacement before melting, requiring a jig to suppress this displacement.
Innovation Solution
A semiconductor device design featuring a metal pattern with first and second recesses, where the electronic component is partially disposed in the first recess and the solder ball is disposed in the second recess, effectively suppressing displacement without the need for a jig.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a spherical solder ball is used for electrical connection, then the quantity of use is easy to manage, but the solder ball is easy to roll and may cause displacement before melting
Solution Approach 1:
The invention applies local quality by creating a recess structure at the specific location where the solder ball needs to be positioned. The recess provides localized confinement for the spherical solder ball, preventing it from rolling away while maintaining the ease of handling spherical solder balls. This localized structural modification solves the contradiction between using spherical solder balls for ease of quantity management and preventing their displacement.
2Reliability
If an electronic component is aligned with a metal pattern on an insulating substrate, then electrical connection can be established, but the electronic component may move during transportation causing displacement
Solution Approach 1:
The invention applies preliminary action by pre-forming recesses in the metal pattern before the electronic component is placed and connected. These recesses are prepared in advance to receive and hold the electronic component and solder ball in the correct positions. This preliminary structural preparation ensures that when the electronic component is later placed and the solder ball is applied, they are automatically positioned correctly without requiring additional alignment steps during assembly.
3Manufacturing precision
If a jig is used to suppress displacement of solder ball, then positioning accuracy is improved, but device complexity increases
Solution Approach 1:
The invention applies self-service by designing the metal pattern with integrated recesses that automatically hold the solder ball and electronic component in place. The structure serves its own positioning function without requiring external jigs or fixtures. The recesses in the metal pattern create a self-contained positioning system that eliminates the need for additional positioning devices, thereby reducing overall device complexity while maintaining positioning accuracy.
Data Source
AI summary
An object of the present invention is to provide a technique capable of suppressing displacement of an electronic component and a solder ball without using a jig. A semiconductor device includes an insulating substrate, an electronic component, and solder. A metal pattern and a semiconductor element are disposed on the insulating substrate. The metal pattern has a first recess and a second recess that are provided side by side. A part of the electronic component is disposed in the first recess. The solder connects the metal pattern disposed on the insulating substrate and the electronic component.