Semiconductor Package Recess Layout for Stable Wire Bonding

The patent introduces a recess structure as an intermediary element between the die bond paste and the conductor pattern. The recess acts as a physical barrier that confines the die bond paste within its application area, preventing it from bleeding onto the conductor patterns. This mediator structure enables both strong bonding and reliable wire connections by spatially separating the paste containment zone from the conductor zones.

The patent applies local quality by creating a recess specifically in the region where die bond paste is applied, while leaving the conductor pattern regions flat and accessible. This localized structural modification ensures that the paste is contained only where needed for bonding, while the conductor patterns remain exposed for reliable wire bonding, thus achieving both bonding strength and connection reliability in their respective zones.

The patent segments the substrate surface into distinct functional zones: a recessed area for die bond paste application and flat areas for conductor patterns. This segmentation is achieved through a simple etching process that creates discrete regions with different depths, allowing the substrate to serve multiple functions without requiring complex three-dimensional structures or additional components.

The patent modifies the substrate structure by changing the depth parameter (creating a recess) in a specific region, while maintaining the overall simplicity of the substrate design. This single parameter change (adding depth variation) is sufficient to prevent paste bleeding without introducing complex multi-layer structures, asymmetric geometries, or additional functional elements, thus achieving reliability improvement with minimal complexity increase.