Semiconductor Package Recessed Alignment Markers
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Solution Overview
Problem
The challenge in semiconductor packaging lies in achieving high alignment precision and reliable contact between semiconductor devices and metal substrates, particularly in mass-producing semiconductor packages with metal substrates, which require precise alignment and efficient separation while maintaining electromagnetic shielding and thermal characteristics.
Innovation Solution
The semiconductor package incorporates recessed portions on the substrate as alignment markers, covered by a resin insulating layer, with an adhesive layer in between, allowing for precise positional alignment and enhanced adhesion, and a manufacturing method that forms these recessed portions and layers to ensure accurate placement and separation of semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor devices are mounted on a large metal support substrate for mass production, then productivity is improved, but alignment precision between semiconductor devices and substrate deteriorates
Solution Approach 1:
The patent introduces a resin insulating layer as an intermediary between the metal support substrate and semiconductor devices. This layer contains recessed portions that serve as alignment markers, enabling precise positioning of semiconductor devices during mounting while maintaining the benefits of large substrate mass production
2Productivity
If semiconductor devices are mounted on a large metal support substrate for mass production, then productivity is improved, but separation yield into individual packages deteriorates
Solution Approach 1:
The patent introduces cutting lines that divide the large metal support substrate into multiple regions, each corresponding to an individual semiconductor package. These cutting lines enable clean separation of mounted semiconductor devices into individual packages, improving separation yield while maintaining mass production efficiency
3Strength
If adhesive layer is used between substrate and semiconductor device, then bonding strength is improved, but delamination occurs at adhesive layer interfaces
Solution Approach 1:
The patent introduces recessed portions in the resin insulating layer that expose portions of the metal support substrate. These recessed portions create localized bonding areas where the adhesive layer forms strong bonds with both the substrate and semiconductor device, preventing delamination at critical interfaces while maintaining overall bonding strength
Data Source
AI summary
A semiconductor package includes a substrate having at least one recessed portion, a semiconductor device located on a surface of the substrate, the surface having the at least one recessed portion, and a resin insulating layer covering the semiconductor device.