Semiconductor Apparatus Recessed Circuit Board for Compact Design
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Solution Overview
Problem
Conventional semiconductor apparatuses face challenges in downsizing due to the increased height and length resulting from larger internal connection terminals and pads, which restrict the reduction of electronic component heights and the overall size of the apparatus.
Innovation Solution
A semiconductor apparatus design featuring a recessed portion in the second circuit board to accommodate first electronic components, allowing for a reduction in the distance between the first and second circuit boards, thereby decreasing the diameter of internal connection terminals and pads, and enabling a more compact longitudinal size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the diameter of internal connection terminals is increased to accommodate taller electronic components, then the height of the semiconductor apparatus increases, but the goal is to reduce the overall size
Solution Approach 1:
The invention transitions from a planar arrangement where components are positioned between flat circuit boards to a three-dimensional arrangement with recessed portions. This allows electronic components to be accommodated in the vertical dimension within the recessed areas, enabling the use of taller components without increasing the overall apparatus height proportionally.
Solution Approach 2:
Instead of increasing the overall board height to accommodate taller components, the invention inverts the approach by creating recessed portions that go downward into the circuit boards. This allows components to be positioned in the recessed areas, effectively using the board thickness dimension to accommodate component height rather than increasing the spacing between boards.
2Reliability
If the size of internal connection terminal pads is increased to accommodate larger diameter terminals, then the length of the circuit boards increases, but the goal is to downsize the apparatus
Solution Approach 1:
The invention moves the connection terminal pads from the surface plane of the circuit boards into recessed portions. This dimensional transition allows pads to be positioned within the vertical depth of the recessed areas, reducing their projection onto the board surface and thereby reducing the overall board length required.
Solution Approach 2:
The connection terminal pads are nested within the recessed portions of the circuit boards, similar to nested dolls. This nesting arrangement allows the pads to be contained within the board structure rather than extending beyond the board edges, reducing the overall apparatus footprint.
Data Source
AI summary
A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.