Semiconductor Component Recessed Cooler Insulation
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Solution Overview
Problem
Semiconductor components, such as power converters, face insulation challenges when their terminals are mounted on a cooler, especially as their size and thickness are reduced, requiring precise distance management to ensure reliable insulation between the cooler and terminals.
Innovation Solution
A recessed portion is formed on the cooler's surface to increase the clearance and creepage distances between the cooler and the terminals, enhancing insulation reliability by providing a non-conductive path for the terminals to project out from the resin molded portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor component size and thickness are reduced, then the productivity and integration density are improved, but the insulation distance between terminals and cooler becomes insufficient
Solution Approach 1:
The recessed portion is formed in the cooler surface to create additional spatial dimension for insulation. By recessing the cooler surface at the terminal mounting position, the insulation distance is extended in the vertical dimension without increasing the horizontal footprint of the semiconductor component, thus resolving the contradiction between reduced thickness and maintained insulation reliability.
Solution Approach 2:
The recessed portion acts as an intermediary structure between the terminal and the cooler body. This intermediate feature provides the necessary insulation clearance while maintaining the electrical connection function, allowing the terminal to be properly insulated from the cooler without requiring increased overall component thickness.
2Reliability
If predetermined distances are secured between cooler surface and terminals for insulation, then the insulation reliability is improved, but the semiconductor component thickness increases
Solution Approach 1:
Instead of uniformly increasing the insulation distance across the entire cooler surface, the recessed portion is localized only at the specific position where terminals are mounted. This local modification provides the necessary insulation clearance exactly where needed, without increasing the overall thickness of the semiconductor component in other regions.
Solution Approach 2:
The insulation distance is extended by utilizing the vertical dimension through the recessed portion rather than increasing the horizontal distance. This allows the terminal to maintain proper insulation clearance while the semiconductor component keeps its reduced thickness profile.
3Volume of moving object
If terminals are drawn out from side surfaces of resin portion, then the thickness is reduced, but the insulation distance to cooler becomes insufficient
Solution Approach 1:
The recessed portion in the cooler serves as an intermediary feature that provides the necessary insulation clearance for terminals drawn out from the side surfaces. This intermediate structure enables the terminals to extend from the resin portion while maintaining adequate insulation distance to the cooler body.
Solution Approach 2:
By forming the recessed portion in the cooler surface, the insulation distance is extended in the vertical dimension rather than requiring increased horizontal distance. This allows terminals to be drawn out from side surfaces for thickness reduction while still achieving sufficient insulation clearance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves insulation reliability and reduces the thickness of the semiconductor component while maintaining effective electrical insulation, even when terminals project out from the resin molded portion.
Implementation Method 1
a recessed portion is formed in a surface of the cooler on which the insulating molded portion is mounted so as to extend from a position facing the terminal to a position at inner side of an end portion of the insulating molded portion
Implementation Method 2
a cooler mounted with the insulating molded portion such that the semiconductor device is cooled
Data Source
AI summary
A semiconductor component includes: a semiconductor device; an insulating molded portion configured to encapsulate the semiconductor device; a terminal connected to the semiconductor device, the terminal being configured to project out from the insulating molded portion; and a cooler mounted with the insulating molded portion such that the semiconductor device is cooled; wherein a recessed portion is formed in a surface of the cooler on which the insulating molded portion is mounted so as to extend from a position facing the terminal to a position at inner side of an end portion of the insulating molded portion.