Semiconductor Device Recessed Sealing Insulation Reliability
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Solution Overview
Problem
Semiconductor modules face insulation breakdown due to tree fractures in flexible insulating resins under high thermal resistance or voltage, and stress-induced peeling of resin molds in large-scale modules, while maintaining adequate insulation distance is challenging, especially at high voltages.
Innovation Solution
A semiconductor device design featuring multiple semiconductor units with recessed sealing portions and connection conductors sealed by hard insulating resin, ensuring high thermal resistance and insulation distance through recessed sealing of connection terminals and conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flexible insulating resin is used to seal the circuit, then the module can be made compact and easy to manufacture, but tree fractures occur due to partial discharge leading to insulation breakdown
Solution Approach 1:
The patent changes the material parameter from flexible insulating resin to hard insulating resin, which fundamentally alters the electrical properties to resist partial discharge and prevent tree fracture formation, thereby maintaining insulation reliability while preserving manufacturing ease
Solution Approach 2:
The patent employs composite material structure by combining hard insulating resin with specific mechanical properties that provide both electrical insulation against partial discharge and mechanical strength to prevent tree fracture propagation, resolving the contradiction between ease of manufacture and insulation reliability
2Reliability
If hard insulating resin is used to seal the circuit, then insulation breakdown is prevented, but stress occurs during heat cycles causing resin mold peeling
Solution Approach 1:
The patent modifies the thermal and mechanical parameters of the hard insulating resin by selecting materials with thermal expansion coefficients matched to the substrate and conductor base, enabling the resin to withstand heat cycle stress without peeling while maintaining its insulation properties
Solution Approach 2:
The patent applies different material properties to different regions: the hard insulating resin provides electrical insulation where needed, while its thermal expansion characteristics are optimized for the specific mounting regions to prevent stress concentration and peeling during thermal cycling
3Quantity of substance
If multiple semiconductor modules are connected in parallel to increase capacitance, then current capacity is increased, but insulation distance cannot be ensured between terminals at high voltages
Solution Approach 1:
The patent transitions from planar terminal arrangement to three-dimensional spatial configuration by utilizing vertical spacing and recessed portions, allowing adequate insulation distance to be maintained between terminals even when multiple modules are connected in parallel, thus enabling increased capacitance while preserving insulation distance at high voltages
Data Source
AI summary
A semiconductor device including semiconductor units 20A to 20C that each include semiconductor elements 12 and 13, a unit case 11 sealing the semiconductor elements, and a first unit terminal 16 exposed inside a first recessed portion 11a provided in a top surface of the unit case; a first unit connection portion 40a including, in correspondence with each of the semiconductor units, a first connection terminal 43S connected to the first unit terminal, a first connection conductor 43S0 connected between a plurality of the first connection terminals, and a first connection conductor sealing portion 40a0 sealing the first connection conductor while exposing the first connection terminals; and first recessed sealing portions 45a that each, in correspondence with each of the semiconductor units, seal each connection portion between the first unit terminal and the first connection terminal inside a recess of the first recessed portion.