Semiconductor Device Recessed Substrate Eliminating Lead Frames
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Solution Overview
Problem
Semiconductor devices face challenges in reducing manufacturing costs and accommodating varying functionalities due to the need for frequent changes in lead frame design and shape, which is costly and limits three-dimensional layout possibilities.
Innovation Solution
A semiconductor device design featuring a substrate with a recessed structure, including a wiring layer and elements housed within hollows, supported by inclined and bottom surfaces, eliminating the need for lead frames and allowing for three-dimensional element placement, thereby reducing costs and enhancing layout flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If metal die is used to form lead frames, then manufacturing efficiency and accuracy are improved, but cost increases when semiconductor device quantity is small
Solution Approach 1:
The patent removes the lead frame component entirely from the semiconductor device structure. Elements are mounted directly on the substrate without requiring separate lead frames, thereby eliminating the need for expensive metal dies while maintaining manufacturing precision through direct element-substrate integration.
Solution Approach 2:
The patent combines the functions of the lead frame and substrate into a single integrated structure. The substrate serves both as the mounting base for elements and as the structural support previously provided by lead frames, reducing component count and manufacturing cost for small quantities.
2Adaptability or versatility
If lead frame size and shape are changed to accommodate functional changes, then adaptability is improved, but manufacturing cost increases due to metal die redesign
Solution Approach 1:
The patent enables dynamic reconfiguration of the semiconductor device layout by allowing elements to be positioned flexibly on the substrate without being constrained by fixed lead frame geometries. This adaptability is achieved through direct mounting on the substrate, which can be easily modified for different functional requirements without costly die redesign.
3Adaptability or versatility
If three-dimensional layout is implemented, then functionality and density are improved, but manufacturing complexity increases
Solution Approach 1:
The patent transitions from traditional two-dimensional lead frame layouts to three-dimensional element placement on the substrate. Elements can be positioned at different heights and depths on the substrate surface, enabling higher density and enhanced functionality while the substrate's flexible nature keeps manufacturing complexity manageable compared to rigid lead frame systems.
Data Source
AI summary
A semiconductor device includes a substrate that is made of a semiconductor material and has a main surface formed with a recess. The semiconductor device also includes a wiring layer formed on the substrate, an electronic element housed in the recess, and a sealing resin covering at least a part of the electronic element.