Semiconductor Device Recessed Substrate Lead Formation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high cost and inefficiency of producing semiconductor devices with varying lead sizes and shapes, due to the need for frequent remaking of expensive metal molds, and the challenge of miniaturization in electronic devices.
Innovation Solution
A semiconductor device design featuring a substrate with recessed portions and a conductive layer that allows for the integration of electronic elements, with a through hole and insulating layers, enabling flexible element placement and reduced material usage, and a method for manufacturing that involves forming recessed portions and interconnects on the substrate to accommodate elements and facilitate miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If metal mold is used for lead formation, then manufacturing efficiency and precision are improved, but manufacturing cost increases due to frequent remaking of molds
Solution Approach 1:
The invention extracts the lead formation process from the metal mold punch processing and relocates it to the PCB board level. Leads are formed by cutting and folding metal strips directly on the PCB, eliminating the need for expensive metal molds and their frequent remaking when lead specifications change.
Solution Approach 2:
The invention replaces expensive, long-lived metal molds with cheap, flexible metal strips that can be easily cut and shaped. These metal strips serve as temporary, disposable leads that can be quickly modified without requiring costly mold remaking processes.
2Adaptability or versatility
If lead size and shape are changed to match different elements, then device functionality is improved, but manufacturing complexity increases due to multiple mold specifications
Solution Approach 1:
The invention creates a universal lead formation method that can produce various lead sizes and shapes using the same basic process. A single type of metal strip can be cut and folded into different configurations to match different element requirements, eliminating the need for multiple specialized molds.
Solution Approach 2:
Instead of using molds to shape leads, the invention inverts the approach by using cutting and folding operations on metal strips. This reverse engineering approach simplifies the process by using basic operations that can create diverse lead geometries without requiring complex tooling.
3Volume of moving object
If electronic devices are miniaturized to meet demand, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The invention replaces the mechanical punch processing system with a cutting and folding system. This substitution allows for more precise control over lead dimensions and shapes, as cutting and folding operations can be more easily controlled and adjusted for miniaturized applications compared to traditional punch processing.
Data Source
AI summary
A semiconductor device is provided with a substrate made of a semiconductor material, an interconnect layer, at least one electronic element, and a sealing resin. The substrate has a main surface and a pair of lateral surfaces that are orthogonal to the main surface and face in opposite directions to each other. A recessed portion that is recessed from the main surface and has an opening portion that opens on at least one of the pair of lateral surfaces is formed in the substrate. The interconnect layer is formed on the substrate. The electronic element is an orientation sensor, for example, and is accommodated in the recessed portion of the substrate. The sealing resin covers the electronic element.