Semiconductor Device with Recessed Substrate for Direction Sensor
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving reliable and stable electrical connections, particularly for direction sensor elements with detection reference axes perpendicular to the substrate, and require size reduction while maintaining high direction detection precision.
Innovation Solution
A semiconductor device design featuring a substrate with a recessed portion and a blocking portion, where the direction sensor element is mounted with its detection reference axis parallel to the substrate, and a sealing resin covering the element and wire, allowing for a more stable and reliable electrical connection and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the detection reference axis is oriented perpendicular to the substrate, then the direction detection capability is improved, but the electrical connection reliability deteriorates
Solution Approach 1:
The patent transitions from a conventional planar mounting approach to a three-dimensional configuration where the semiconductor element is mounted upright on the substrate surface. The detection reference axis is oriented perpendicular to the substrate, utilizing the vertical dimension to achieve improved direction detection precision while maintaining electrical connection reliability through side surface exposure for bonding.
2Measurement precision
If the direction sensor element is mounted upright with detection reference axis perpendicular to substrate, then the geomagnetic detection precision is improved, but the device complexity increases
Solution Approach 1:
The patent incorporates a recessed portion in the substrate before mounting the semiconductor element. This preliminary structural preparation facilitates the upright mounting configuration and simplifies subsequent wire bonding operations by providing pre-configured bonding surfaces, thereby reducing overall device complexity despite the three-dimensional element orientation.
3Volume of moving object
If the semiconductor element size is reduced, then the device size reduction is achieved, but the electrical connection stability deteriorates
Solution Approach 1:
The patent features a recessed portion in the substrate that accommodates the semiconductor element in an upright position. This nested configuration allows the element to be securely positioned within the substrate structure, providing mechanical stability and reliable electrical connections through the side surface bonding approach, thereby enabling size reduction without compromising connection stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the reliability and stability of electrical connections and reduces the size of the semiconductor device while maintaining high geomagnetic direction detection precision, addressing the challenges of connecting perpendicular direction sensor elements and achieving size reduction.
Implementation Method 1
a wire having a bonding portion bonded to the element pad
Implementation Method 2
a sealing resin formed on the main surface of the substrate, and covering the wire and at least a portion of the semiconductor element
Data Source
AI summary
A semiconductor device includes: a substrate including a base member having a main surface and a back surface facing opposite in a thickness direction; a semiconductor element mounted on the main surface of the substrate and having at least one element pad; a wire having a bonding portion bonded to the element pad; and a sealing resin formed on the main surface of the substrate for covering the wire and at least a portion of the semiconductor element. The semiconductor element has an element exposed side surface that faces in a direction crossing the thickness direction of the substrate and is exposed from the sealing resin.