Semiconductor Package Redistribution Structure with Seal Patterns
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Solution Overview
Problem
The integration of multiple semiconductor devices in miniaturized electronic devices poses challenges due to limitations in packaging and assembling techniques, particularly in achieving lower transmission and insertion losses for higher speed and performance.
Innovation Solution
A semiconductor package manufacturing process involving a carrier with through insulator vias, semiconductor dies, and a redistribution structure with multiple layers, including seed layers, seal patterns, and dielectric layers, to enhance electrical connectivity and protect against oxidative damage, allowing for efficient integration and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor devices are integrated in miniaturized electronic devices, then device functionality and performance are improved, but oxidative damage and reliability issues worsen
Solution Approach 1:
The patent implements a nested multi-layer structure where conductive traces are embedded within dielectric layers, which are in turn protected by encapsulants. Each layer is contained within the previous layer, creating a protective hierarchy that shields the conductive traces from oxidative damage while maintaining device integration capability
Solution Approach 2:
The patent employs sacrificial oxide layers and removable masks that are intentionally designed to be temporary and consumable. These layers are used during manufacturing to protect or define structures, then removed after serving their purpose, allowing for precise patterning without permanent harmful residues
2Ease of manufacture
If conventional packaging and assembling techniques are used, then manufacturing simplicity is maintained, but transmission loss and insertion loss increase
Solution Approach 1:
The patent transitions from conventional two-dimensional wafer-level packaging to three-dimensional stacked packaging with vertical interconnects. Conductive traces and dielectric layers are arranged in multiple vertical levels, enabling shorter signal paths and reduced transmission loss while maintaining manufacturing feasibility through adapted packaging processes
Solution Approach 2:
The patent divides the packaging structure into discrete functional layers (conductive traces, dielectric layers, encapsulants) that can be manufactured and assembled separately. This segmentation allows optimization of each layer for its specific function while maintaining overall manufacturing simplicity through modular assembly processes
3Reliability
If robust electrical connections are ensured through multiple layers, then reliability is improved, but device complexity increases
Solution Approach 1:
The dielectric layers serve multiple functions simultaneously: they provide electrical insulation between conductive traces, mechanical support for the structure, and protection against environmental factors. This multi-functionality reduces the need for additional specialized layers, maintaining reliability while controlling complexity
Solution Approach 2:
The patent uses uniform dielectric materials with consistent properties across all dielectric layers. This homogeneity simplifies manufacturing processes and quality control while ensuring predictable electrical performance and reliability, avoiding the complexity that would arise from using different materials for each layer
Data Source
AI summary
A semiconductor package includes a semiconductor die and a redistribution structure. The redistribution structure is electrically connected to the semiconductor die. The redistribution structure includes dielectric layers, conductive traces and seal patterns. The conductive traces are embedded in the dielectric layers. At least one conductive trace of the conductive traces includes a via pattern and a routing pattern. The seal patterns are disposed on the conductive traces. One seal pattern of the seal patterns is disposed between a top surface of the routing pattern and a first dielectric layer of the dielectric layers.