Semiconductor Structure with Metal Reflective Layer for UV Glue Curing
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Solution Overview
Problem
The existing UV-curing process for UV glue in semiconductor manufacturing is time-consuming, limiting manufacturing efficiency and prone to producing defective products due to insufficient adherence if the curing time is shortened.
Innovation Solution
A semiconductor structure with a metal reflective layer on the substrate surface to enhance ultraviolet ray absorption, accelerating the curing of UV glue by reflecting the rays and reducing the curing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If UV glue curing time is extended to ensure secure adherence, then reliability of bonding is improved, but productivity of semiconductor manufacturing deteriorates
Solution Approach 1:
A metal reflective layer is introduced as an intermediary between the UV glue and the substrate. This reflective layer bounces UV rays back onto the UV glue, enhancing the curing effect without requiring extended exposure time. The mediator (reflective layer) enables both rapid curing and strong adherence simultaneously
Solution Approach 2:
The invention changes the optical parameters of the bonding interface by introducing a reflective layer with high UV reflectivity. This parameter change (from absorbing surface to reflective surface) intensifies the UV radiation absorbed by the UV glue, accelerating the curing process while maintaining bond strength
2Productivity
If UV glue curing time is shortened to increase manufacturing efficiency, then productivity is improved, but reliability of bonding deteriorates due to insufficient adherence
Solution Approach 1:
The metal reflective layer serves as a mediator that concentrates UV radiation onto the UV glue, enabling complete curing in reduced time. The reflective layer ensures that even during shortened exposure, the UV glue receives sufficient cumulative UV energy for proper curing and strong bonding
Solution Approach 2:
The reflective layer creates a periodic reflection pattern of UV rays, continuously bouncing UV radiation back onto the UV glue throughout the curing process. This periodic reinforcement of UV exposure ensures thorough curing even when total exposure time is reduced
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal reflective layer significantly reduces UV glue curing time by approximately ⅕, thereby increasing manufacturing efficiency and ensuring secure adherence.
Implementation Method 1
the metal reflective layer reflects the ultraviolet ray and accelerates the curing of the UV glue
Implementation Method 2
Through the radiation of an ultraviolet ray, the UV glue is cured from liquid state to solid state
Data Source
AI summary
The present invention provides a semiconductor structure including a substrate, a metal reflective layer, a UV glue layer, and an element. The metal reflective layer is placed on the surface of the substrate, and the UV glue layer is placed on the surface of the metal reflective layer. The element is manufactured by light-transparent material. The UV glue layer adheres the element to the metal reflective layer. By so, in the light-curing process, the curing of the UV glue is accelerated due to the metal reflective layer reflecting an ultraviolet ray.