Semiconductor Package Reflector for Antenna Radiation Direction
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Solution Overview
Problem
High-frequency wireless communication devices face signal attenuation due to radiation being transmitted in multiple directions without effective directionality, leading to reduced radiation efficiency and gain in antennas.
Innovation Solution
Incorporating a reflector within the semiconductor device package to direct radiation emitted by the antenna, with a precise distance tolerance between the antenna and reflector to enhance radiation efficiency, and integrating the antenna and reflector into a single package to minimize misalignment and size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If radiation is transmitted without directionality, then the device structure is simple, but signal attenuation increases and radiation efficiency decreases
Solution Approach 1:
A reflector structure is introduced as an intermediary component between the antenna and the environment. The reflector mediates the radiation by redirecting electromagnetic waves that would otherwise be lost, thereby reducing signal attenuation without requiring fundamental changes to the antenna design itself.
Solution Approach 2:
The solution moves from considering only the horizontal radiation pattern to incorporating vertical dimension control through the reflector. By adding this spatial dimension, the system achieves directional radiation control and reduces signal loss in specific directions while maintaining overall structural simplicity.
2Reliability
If antenna and reflector are integrated into a single package, then misalignment is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The antenna and reflector are merged into a single integrated package structure. This combination ensures that both components maintain fixed relative positions, eliminating misalignment issues that would occur with separate mounting while achieving reliable directional radiation performance.
Solution Approach 2:
The design specifies a particular distance range (2-8 micrometers) between the antenna and reflector as an optimal parameter. By controlling this critical dimension within a defined range rather than requiring exact precision, the design achieves reliable performance while accommodating normal manufacturing variations.
3Loss of energy
If reflector is added to direct radiation, then radiation efficiency and gain improve, but device size increases
Solution Approach 1:
The reflector is positioned and configured to nest within the existing device package footprint rather than requiring additional external space. By strategically placing the reflector in available spaces and optimizing its geometry, the design achieves improved radiation efficiency while minimizing the overall device volume increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves radiation efficiency and gain by directing radiation in specific directions, reducing signal attenuation and misalignment issues, while also potentially reducing the overall size of the device package.
Implementation Method 1
Incorporating a reflector within the semiconductor device package to direct radiation emitted by the antenna
Data Source
AI summary
A semiconductor device package includes a circuit layer, an antenna structure, a first encapsulant and a reflector. The circuit layer has a first surface, a second surface opposite to the first surface and a third surface extended between the first surface and the second surface. The antenna structure is disposed within the circuit layer. The first encapsulant is disposed on the first surface of the circuit layer, the first encapsulant having a surface. The reflector is disposed on the first encapsulant. The third surface of the circuit layer is substantially coplanar with the surface of the first encapsulant.