Semiconductor Refrigeration Cup with Integrated Heat-Dissipation Base
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Solution Overview
Problem
Current semiconductor refrigeration cups have unsatisfactory heat-dissipation effects, which limits their performance.
Innovation Solution
A semiconductor refrigeration cup design featuring a semiconductor refrigeration assembly embedded in the cup body, a heat-dissipation member on the base, and an air duct with a fan to enhance heat dissipation, along with a temperature sensor and insulation for improved functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If semiconductor refrigeration assembly is embedded in cup body without external heat-dissipation structure, then device simplicity is maintained, but heat-dissipation effect is insufficient
Solution Approach 1:
The device is divided into separate functional modules: the semiconductor refrigeration assembly embedded in the cup body and the heat-dissipation member integrated with the base. This segmentation allows each component to perform its specific function optimally while maintaining overall system simplicity.
Solution Approach 2:
The heat-dissipation member is merged with the base structure, and the fan is integrated into the base, combining multiple functions (support, heat dissipation, air circulation) into a single structural unit. This reduces the number of separate components while improving heat-dissipation effectiveness.
2Temperature
If fan and air duct are added to base for active cooling, then heat-dissipation effect is improved, but device complexity increases
Solution Approach 1:
The base is designed to perform multiple functions: supporting the cup body, housing the heat-dissipation member, containing the fan and air duct system, and providing power supply connections. This multi-functionality reduces the need for separate components while achieving effective active cooling.
Solution Approach 2:
The fan-driven air circulation system creates self-sustaining heat dissipation by drawing air through the air duct and directing it over the heat-dissipation member, automatically removing heat without requiring external intervention or complex control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves rapid heat dissipation and improved performance by directing airflow towards the heat-dissipation member, ensuring effective cooling and convenience in use.
Implementation Method 1
semiconductor refrigeration assembly embedded in the bottom wall of the cup body
Implementation Method 2
a fan disposed in the air duct are arranged in the base, and an air outlet of the air duct faces the heat-dissipation member
Implementation Method 3
heat-dissipation member is arranged over the bottom of the cup body and abuts against the end, located outside the cup body, of the semiconductor refrigeration assembly
Implementation Method 4
heat of the heat-dissipation member is dissipated rapidly
Data Source
AI summary
A semiconductor refrigeration assembly includes a semiconductor refrigeration assembly, a heat-dissipation member, a cup body, and a base. The semiconductor refrigeration assembly is embedded in the bottom wall of the cup body and has an end exposed out of the cup body. The heat-dissipation member is arranged over the bottom of the cup body and abuts against the end, located outside the cup body, of the semiconductor refrigeration assembly. The base is configured to support the heat-dissipation member and to supply power to the semiconductor refrigeration assembly. The semiconductor refrigeration cup has a better heat-dissipation effect.