Semiconductor Device Relay Board Three-Dimensional Wiring
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Solution Overview
Problem
The existing semiconductor devices face issues with external electrode soldering, including reduced degree of freedom in wiring, increased size, uneven solder thickness, over-engineering for signal circuits, difficulty in soldering to narrow areas, and stress on solder joints due to direct deformation or soldering, leading to inefficiencies and increased costs.
Innovation Solution
A semiconductor device design featuring a relay board with an insulating plate, protrusion conductors, and external electrodes that allow for three-dimensional wiring, reducing the need for large external electrodes and enabling precise soldering, while using different materials for signal and main circuit conductors to optimize current capacity and reduce material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If plural external electrodes are soldered to the semiconductor chip at the same time, then wiring is simplified, but it is difficult to make the external electrodes even in height resulting in irregular solder thickness
Solution Approach 1:
The patent introduces a relay board positioned between the semiconductor chip and external electrodes, creating a three-dimensional wiring structure. This allows external electrodes to be connected to different locations on the relay board, enabling height adjustment and uniform solder thickness while maintaining wiring simplicity.
Solution Approach 2:
The relay board acts as an intermediary component between the semiconductor chip and external electrodes. It provides intermediate connection points that facilitate height adjustment and uniform soldering, resolving the conflict between simplified wiring and manufacturing precision.
2Strength
If the external electrode is formed to be relatively thick to secure strength, then joint strength is improved, but it becomes difficult to solder to narrow area sites with high precision
Solution Approach 1:
The patent divides the connection structure into multiple segments: the semiconductor chip, relay board, and external electrodes. This segmentation allows the external electrodes to be thinner and more precisely soldered to the relay board, while the overall structure maintains strength through the distributed connection points on the relay board.
3Ease of manufacture
If the same electrode structure is used for both signal circuit portion and main circuit portion, then manufacturing is simplified, but the signal circuit portion becomes over-engineered resulting in increased cost and size
Solution Approach 1:
The patent applies different electrode structures to different functional areas: the main circuit portion uses robust external electrodes for high current capacity, while the signal circuit portion uses thinner electrodes appropriate for low current signals. This local differentiation optimizes material usage and reduces cost while maintaining manufacturing simplicity through standardized relay board processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient three-dimensional wiring, reduces the outer size of the semiconductor device, ensures uniform solder thickness, and enhances joint reliability, thereby preventing soldering-related troubles and minimizing material costs.
Implementation Method 1
a first lower conductor including a lower main body that is formed on a lower surface of the insulating plate and soldered to any of the plurality of semiconductor chips
Data Source
AI summary
A semiconductor device includes semiconductor chips fixed to a board, an insulating plate having a through-hole formed therein, a first lower conductor including a lower main body formed on the lower surface of the insulating plate and soldered to any of the semiconductor chips, and a lower protrusion portion that connects with the lower main body, and extends to the outside of the insulating plate, a second lower conductor formed on a lower surface of the insulating plate and soldered to any of the semiconductor chips, an upper conductor including an upper main body formed on the upper surface of the insulating plate, and an upper protrusion portion that connects with the upper main body and extends to the outside of the insulating plate, and a connection portion provided in the through-hole and connects the upper main body and the second lower conductor.