Semiconductor Package Mold Release Film for Reliable Peeling
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Solution Overview
Problem
Existing mold release films for semiconductor packages are prone to breaking during peeling, leading to mold release layer remnants adhering to the package, which is undesirable as package structures become more complex and precise.
Innovation Solution
A mold release film with a mold release layer having an elongation rate at break of 120% or more and an average thickness of 5 μm or more, containing a urethane resin with specific alkylene oxide skeletons and urethane bonds, and a base material layer made of polyester film, enhancing stretchability and reducing breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mold release layer made of acrylic resin is used to ensure releasability, then releasability from the molded product is improved, but the mold release layer is easily broken during peeling and adheres to the package
Solution Approach 1:
The patent changes the material parameters of the mold release layer by using a copolymer consisting of a vinyl ester component and a vinyl aromatic component, with specific glass transition temperature ranges (-50°C to 0°C for vinyl ester, 80°C to 120°C for vinyl aromatic). This parameter optimization enables the layer to maintain both releasability and resistance to breakage during peeling operations.
Solution Approach 2:
The patent employs a composite material system where the mold release layer is formed as a copolymer combining vinyl ester and vinyl aromatic components. This composite approach allows the material to exhibit both the low-temperature flexibility needed for releasability and the structural integrity required to prevent breakage and adhesion during peeling.
2Manufacturing precision
If the package structure becomes more complicated to meet precision requirements, then manufacturing precision is improved, but the mold release layer is more easily broken during peeling
Solution Approach 1:
The patent optimizes the glass transition temperature parameters of the copolymer components to match the specific requirements of complicated package structures. By adjusting the ratio and types of vinyl ester and vinyl aromatic monomers, the material achieves the flexibility and strength needed for precise, complex package geometries without breakage during peeling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The film significantly reduces the occurrence of mold release layer remaining on the semiconductor package, ensuring reliable peeling and maintaining package integrity.
Implementation Method 1
an elongation rate at break of the mold release layer is 120% or more
Data Source
AI summary
A mold release film including: a mold release layer; and a base material layer, in which an elongation rate at break of the mold release layer is 120% or more, and an average thickness of the mold release layer is 5 μm or more.