Semiconductor Repair Apparatus with Laser Separation and Bump Conditioning
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Solution Overview
Problem
Current semiconductor repair processes apply excessive thermal energy, potentially damaging substrates and nearby components, and rely on manual intervention, leading to unpredictable repair outcomes and reduced production yields.
Innovation Solution
A semiconductor manufacturing apparatus is developed, featuring a component separating apparatus using localized laser heating and suction to safely remove defective components, a bump conditioning apparatus for shaping connection bumps to a target height, and a component attaching apparatus for precise mounting of new components, all automated to improve yield and reduce thermal and mechanical damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current repair processes apply considerable thermal energy to remove defective components, then the defective component can be separated from the substrate, but the substrate, other proximate components and wiring may be damaged
Solution Approach 1:
The patent applies localized heating through a focused heating element that targets only the specific defective component and its immediate mounting area, rather than heating the entire substrate. This localized approach provides sufficient thermal energy to separate the defective component while minimizing thermal damage to the substrate and other proximate components by limiting the spatial extent of the thermal field.
Solution Approach 2:
The repair process is divided into distinct sequential steps: heating and separation of the defective component, cleaning of the substrate, conditioning of the connection bump, and mounting of the new component. This segmentation allows each step to be optimized independently, with controlled heating applied only when and where needed for component separation, thereby reducing overall thermal exposure and damage risk.
2Adaptability or versatility
If manual intervention is used to accomplish repair, then flexibility in handling complex repair scenarios is improved, but repair outcomes become unpredictable and production yield suffers
Solution Approach 1:
The apparatus is designed to perform the entire repair process automatically without manual intervention. The system includes automated component separation through controlled heating, automated cleaning mechanisms, automated connection bump conditioning, and automated new component mounting. This automation eliminates variability in repair outcomes while maintaining the flexibility to handle different repair scenarios through programmable control.
Solution Approach 2:
Manual mechanical operations are replaced with automated mechanical and thermal systems. The apparatus uses controlled thermal fields for component separation, automated mechanical arms or conveyors for component handling, and precision positioning systems for mounting, replacing manual dexterity with programmable automation that provides consistent, repeatable results.
3Ease of manufacture
If connection bumps are not properly conditioned to target height, then the mounting process is simplified, but reliable coupling between new component and substrate cannot be achieved
Solution Approach 1:
The connection bump is conditioned to the target height before the new component is mounted. This preliminary conditioning ensures that the bump is at the optimal height for reliable coupling, and any necessary adjustments are made in advance. This allows the subsequent mounting process to be simple and straightforward while guaranteeing reliable electrical and mechanical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves predictable and high-quality repair processes by minimizing thermal damage and eliminating the variability associated with manual intervention, resulting in improved semiconductor module production yields.
Implementation Method 1
a laser light source configured to generate a laser beam, and irradiate the defective component with the laser beam through the frame and the opening of the aperture
Implementation Method 2
a suction pump configured to apply a suction force to the defective component through the frame and the opening of the aperture to separate the defective component from the substrate
Implementation Method 3
a bump conditioning apparatus including an end mill cutter and receiving the substrate following separation of the defective component from the substrate, the bump conditioning apparatus being configured to cut a first connection bump using the end mill cutter
Data Source
AI summary
A semiconductor manufacturing apparatus includes; a component separating apparatus configured to separate a defective component from a substrate, a bump conditioning apparatus including an end mill cutter and receiving the substrate following separation of the defective component from the substrate, the bump conditioning apparatus being configured to cut a first connection bump using the end mill cutter to provide a conditioned first connection bump, and the first connection bump being exposed by separating the defective component from the substrate, and a component attaching apparatus configured to receive the substrate following provision of the conditioned first connection bump, and mount a new component including a second connection bump to the substrate by coupling the second connection bump and the conditioned first connection bump.