Selective Cleaning Composition for Semiconductor Residue Removal
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Solution Overview
Problem
Current etching processes, such as reactive ion etching, leave residues on semiconductor surfaces that are difficult to remove without damaging adjacent metal, low-k, and high-k dielectric materials, which are critical in microelectronic structure fabrication.
Innovation Solution
A selective cleaning composition and method using a mixture of water-soluble organic solvents, fluoride-containing compounds, and quaternary ammonium compounds that selectively remove photoresist and etching residues without attacking metal or dielectric materials, suitable for sensitive low-k films like HSQ and MSQ.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional etching processes are used, then pattern transfer is achieved, but residues remain on the substrate that are difficult to remove
Solution Approach 1:
The patent introduces a multi-component cleaning composition as an intermediary substance that mediates between the residue contamination and the substrate. This composition contains surfactants, chelating agents, and organic solvents that work together to bind and remove residues without damaging the underlying metal or dielectric layers, thus resolving the contradiction between achieving pattern transfer and preventing residue accumulation.
Solution Approach 2:
The patent employs parameter changes by adjusting the chemical composition, pH, and temperature of the cleaning solution to optimize residue removal. By controlling these parameters, the cleaning process effectively removes residues while maintaining selectivity and preventing damage to sensitive microelectronic structures.
2Object-generated harmful factors
If strong cleaning agents are used to remove residues, then cleaning effectiveness improves, but damage to metal and dielectric materials increases
Solution Approach 1:
The patent applies local quality by designing a cleaning composition with different components that act selectively on different types of contaminants and substrate materials. The surfactants target organic residues, chelating agents bind metal-containing residues, and the formulation is optimized to have different interaction strengths with various materials, thereby achieving effective residue removal while protecting sensitive metal and dielectric layers through selective action.
Solution Approach 2:
The patent uses a composite cleaning composition containing multiple active ingredients (surfactants, chelating agents, organic solvents) and inactive ingredients working synergistically. This composite approach allows the solution to address multiple types of residues simultaneously while the balanced formulation prevents excessive etching or damage to the substrate materials.
3Object-generated harmful factors
If selective cleaning is implemented, then residue removal is improved, but process complexity increases
Solution Approach 1:
The patent achieves universality by formulating a single cleaning composition that performs multiple functions: removing organic residues, inorganic residues, and metal-containing residues simultaneously. This multi-functional approach eliminates the need for multiple separate cleaning steps, thereby maintaining high selectivity while reducing overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes residues with minimal etch rates on dielectric materials, maintaining the integrity of metal and dielectric layers, and is compatible with various low and high-k materials, ensuring high selectivity and minimal corrosion.
Implementation Method 1
A selective cleaning composition and method using a mixture of water-soluble organic solvents, fluoride-containing compounds, and quaternary ammonium compounds that selectively remove photoresist and etching residues
Implementation Method 2
A selective cleaning composition and method using a mixture of water-soluble organic solvents, fluoride-containing compounds, and quaternary ammonium compounds
Implementation Method 3
A selective cleaning composition and method using a mixture of water-soluble organic solvents, fluoride-containing compounds, and quaternary ammonium compounds
Data Source
AI summary
A composition comprising one or more water soluble organic solvents comprising a glycol ether; water; a fluoride containing compound provided that if the fluoride containing compound is ammonium fluoride than no additional fluoride containing compound is added to the composition; optionally a quaternary ammonium compound; and optionally a corrosion inhibitor is disclosed herein that is capable of removing residues from an article such as photoresist and/or etching residue. Also disclosed herein is a method for removing residues from an article using the composition disclosed herein.